Series-Connected Open-Frame Power Supply for Cooling and Cost
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Solution Overview
Problem
Existing power supply devices with redundant modules face challenges in heat dissipation and cost due to over-design, and suffer from back pressure and thermal eddy currents, while enclosure power supplies are costly and not market-friendly.
Innovation Solution
A power supply device with at least two power supplies, where one is an open-frame power supply connected in series, includes a tray with a handle for easy replacement, adjustable partitions for airflow management, and shared cooling fans to optimize cooling efficiency and reduce costs by omitting active current-sharing control circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two enclosure power supplies are connected in parallel to achieve redundancy and current sharing, then reliability is improved, but device complexity and cost increase due to requiring all circuit components and casings for each power supply
Solution Approach 1:
The power supply system is segmented into two types: one complete enclosure power supply and one open-frame power supply. The open-frame power supply lacks certain non-essential components and casing, reducing complexity while maintaining electrical functionality. This segmentation allows redundancy without requiring full duplication of all components.
Solution Approach 2:
The open-frame power supply extracts only the essential electrical components needed for power conversion, removing the enclosure and non-essential circuit components. This extraction maintains the core power supply function while reducing device complexity and cost.
2Reliability
If two enclosure power supplies are configured in parallel with left-right arrangement, then power supply redundancy is achieved, but heat dissipation performance deteriorates due to back pressure and thermal eddy currents
Solution Approach 1:
The power supplies are arranged in a front-back spatial configuration instead of the conventional left-right parallel arrangement. This dimensional change in spatial layout optimizes airflow patterns and thermal management, reducing back pressure and thermal eddy currents while maintaining redundancy.
3Reliability
If enclosure power supplies with all circuit components and casings are used, then reliability is improved, but cost increases due to over-design
Solution Approach 1:
The open-frame power supply uses a simplified design without a protective enclosure and with minimal circuit components, making it cheaper to manufacture. While less robust than a full enclosure unit, it provides sufficient functionality for redundancy purposes at lower cost.
4Device complexity
If series connection is used for open-frame power supply, then device complexity is reduced by saving connectors and filter circuits, but power supply configuration becomes less conventional
Solution Approach 1:
The series connection merges the output of the first power supply with the input of the second power supply, eliminating the need for separate connectors and filter circuits between them. This combining of functions reduces device complexity while the modular design maintains configuration flexibility.
Data Source
AI summary
A power supply device is installed inside a casing having an accommodation space. The power supply device includes at least two power supplies. The at least two power supplies are disposed in the accommodation space, and at least one of the at least two power supplies is an open-frame power supply. Each of the at least two power supplies includes a connection unit, and the at least two power supplies are connected in series through the connection units.