Open-Notch Pad Structure for Short-Safe Semiconductor Packaging
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Solution Overview
Problem
Existing packaging solutions for power semiconductor chips face challenges in managing heat generation, which limits reliability and performance due to the need for precise assembly processes to avoid shorts between pads.
Innovation Solution
A package design that incorporates a spacer body with an open notch, bridging the open notch of the electronic component's pad, enhancing thermal and electrical coupling while preventing assembly-related shorts by maintaining a precise distance between pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional pad design without open notch is used, then the assembly process can be less precise, but the risk of shorts between pads increases
Solution Approach 1:
The pad is segmented by introducing an open notch that divides the pad into separate regions. This segmentation physically isolates adjacent pads from each other, preventing solder bridges and shorts while maintaining ease of assembly. The notch creates distinct mounting zones for electronic components, eliminating the risk of inter-pad shorts without requiring high assembly precision.
Solution Approach 2:
The open notch acts as an intermediary barrier between adjacent pads. By introducing this intermediate structure, the patent prevents direct contact or solder bridge formation between pads, thereby eliminating shorts without compromising assembly precision requirements.
2Reliability
If the coupling surface area between spacer and pad is increased, then thermal and electrical reliability improves, but the complexity of the pad structure increases
Solution Approach 1:
The pad structure is segmented into multiple functional regions by the open notch: mounting regions for electronic components and coupling regions for the spacer. This segmentation allows the coupling surface area to be increased in specific areas without complicating the overall pad structure, as the notch clearly defines the boundaries of each functional zone.
Solution Approach 2:
The open notch creates local quality variations in the pad structure, with different regions serving different functions. The areas adjacent to the notch provide enhanced coupling surface area for thermal and electrical reliability, while the notch itself maintains structural simplicity by providing clear separation without requiring complex geometries.
Data Source
AI summary
A package is disclosed. In one example, the package comprises an electronic component having a first main surface with an electrically conductive first pad. The first pad has an open notch, and a spacer body mounted on the first pad and bridging at least part of the open notch.