Open Stub Signal Reflection for Memory Package Distortion
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Solution Overview
Problem
Existing semiconductor memory packages face challenges in achieving high-speed operation due to signal distortion caused by reflections at the ends of branch lines, particularly when multiple semiconductor memory chips are connected to a single channel memory interface without adequate signal compensation.
Innovation Solution
Incorporating an open stub connected to the common line within the memory interface, which extends from the package terminal to the branch point and has one end connected to the common line and the other end open, helps compensate for signal distortion by reflecting signals and improving signal characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor memory chips are connected to one channel memory interface, then the capacity demand is met, but signal distortion occurs due to reflections at the ends of branch lines
Solution Approach 1:
The patent converts the harmful signal reflection into a beneficial effect by introducing an open stub that deliberately reflects signals. This controlled reflection compensates for the signal distortion caused by branch line reflections, transforming the harmful interference into a useful signal quality improvement mechanism
Solution Approach 2:
The open stub acts as an intermediary element between the common line and the ground plane layer. It mediates the signal transmission by providing a controlled reflection path that compensates for signal distortion, serving as a buffer that improves overall signal quality without disrupting the existing chip connection architecture
2Quantity of substance
If multiple semiconductor memory chips are connected to one channel memory interface, then high capacity is achieved, but high-speed operation becomes difficult due to signal distortion
Solution Approach 1:
The open stub converts the harmful signal reflection into a beneficial compensation mechanism. By deliberately creating a controlled reflection, it抵消es the signal distortion that would otherwise limit high-speed operation, enabling faster data transmission rates while maintaining multiple chip connections
Solution Approach 2:
The patent changes the electrical parameters of the signal transmission path by introducing the open stub with specific length and impedance characteristics. This parameter modification alters the reflection properties of the system, optimizing signal quality for high-speed operation across multiple chip connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The open stub enhances signal quality and allows for high-speed operation by mitigating signal distortion, ensuring improved performance in semiconductor memory packages with multiple connected chips.
Implementation Method 1
an open stub extending from the common line, the open stub having one end connected to the common line and another other end which is open without being connected to another electrical path... helps compensate for signal distortion by reflecting signals
Data Source
AI summary
A semiconductor memory package is provided. The package includes a base substrate, and chip connection pads and external connection pads respectively arranged on upper and lower surfaces of the base substrate; and two semiconductor memory chips mounted on the base substrate each having chip pads electrically connected to the chip connection pads. A first electrical path extends from an external connection pad to a first chip pad of one of the chips and a second electrical path extends from the external connection pad to a second chip pad of another chip, the first and second electrical paths have a common line, and the first electrical path has a first branch line and the second electrical path has a second branch line. The base substrate includes an open stub extending from the common line and having an end which is open without being connected to another electrical path.


