Open-Terminal Shielded Semiconductor Package for EMI Isolation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Traditional semiconductor package shielding methods completely cover the top, causing short circuits with exposed terminals or sockets, which are necessary for connecting to adjacent devices, thus failing to provide both EMI shielding and exposed connections.

Innovation Solution

The method involves forming an electromagnetic interference (EMI) shielding layer over semiconductor packages while using a sputter mask or jig to selectively remove the shielding layer from exposed terminals or sockets, or employing laser ablation to isolate these areas, ensuring the shielding layer covers all surfaces except the terminals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a shielding layer is formed completely over the package top, then EMI shielding effectiveness is improved, but exposed terminals or sockets are covered causing short circuits

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidterminal connectivity

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent applies local quality by creating different surface properties in different regions of the package. The top surface has a complete shielding layer for EMI protection, while the side surfaces have selective openings that expose terminals or sockets for connectivity. This regional differentiation allows simultaneous achievement of EMI shielding and terminal accessibility without short circuits.

Inventive Principle:

Principle #3Local quality

2Reliability

If the shielding layer is removed over terminals to maintain connectivity, then terminal exposure is improved, but EMI shielding effectiveness deteriorates

Engineering Contradiction:

Improveterminal exposureVSAvoidEMI shielding effectiveness

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a two-dimensional top-down shielding approach to a three-dimensional multi-surface shielding structure. By forming shielding layers on side surfaces and creating controlled openings in specific regions, the invention achieves EMI protection while maintaining terminal exposure. The shielding operates in multiple spatial dimensions (top, sides, and selective regions) rather than just covering the top surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively shields semiconductor devices from EMI while maintaining exposed terminals for connections, preventing short circuits and ensuring proper operation and interconnectivity.

Implementation Method 1

forming an electromagnetic interference (EMI) shielding layer over semiconductor packages while using a sputter mask or jig to selectively remove the shielding layer from exposed terminals or sockets

Methodology Applied

Scientific EffectSputtering: Sputtering

Implementation Method 2

employing laser ablation to isolate these areas, ensuring the shielding layer covers all surfaces except the terminals

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS11784133B2Shielded semiconductor package with open terminal and methods of making

Publication Date: 2023.10.10 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.