Operation panel assembly for electric appliances and washing machine employing same
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Solution Overview
Problem
Operation panel assemblies in electric appliances are vulnerable to moisture and water exposure, which can damage electronic components and lead to malfunction, requiring costly waterproofing processes that increase manufacturing costs.
Innovation Solution
A waterproof operation panel assembly design featuring a first cover with an open front portion and side extension forming an accommodation space, a waterproof coating layer on the operation panel board, and a second cover that closes the space, eliminating the need for a polyurethane molding layer and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional waterproofing processes (polyurethane molding layer) are used to protect electronic components from moisture, then reliability is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The waterproofing function is segmented into two parts: (1) a physical barrier formed by the first cover's side portion and second cover that encloses the operation panel board, and (2) a simplified waterproof coating layer applied directly to the operation panel board. This segmentation eliminates the need for complex polyurethane molding processes while maintaining effective moisture protection.
Solution Approach 2:
The first cover and second cover act as intermediary protective structures that physically isolate the operation panel board from moisture. The side portion of the first cover extends to form a barrier, and the second cover closes the accommodation space, creating an intermediate protective environment between the electronics and external moisture.
2Reliability
If conventional waterproofing methods are employed, then moisture protection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent employs a cost-effective waterproof coating layer instead of expensive polyurethane molding processes. The coating layer is applied directly to the operation panel board using simpler, more affordable manufacturing techniques, significantly reducing production costs while maintaining adequate waterproof protection.
Solution Approach 2:
The patent extracts and eliminates the complex polyurethane molding layer from the waterproofing system, retaining only the essential protective function through simpler means. The side portion of the first cover and second cover provide the primary waterproof barrier, allowing the removal of costly molding processes.
3Ease of manufacture
If the operation panel board is exposed to moisture, then manufacturing simplicity is maintained, but electronic components are damaged and reliability decreases
Solution Approach 1:
The patent uses a thin waterproof coating layer applied directly to the operation panel board, combined with the flexible enclosure formed by the first cover and second cover. This thin-film approach provides effective moisture protection while maintaining manufacturing simplicity and avoiding complex multi-layer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively protects electronic components from moisture while reducing manufacturing costs by omitting the polyurethane molding process, ensuring reliable operation and cost-effectiveness.
Implementation Method 1
a waterproof coating layer formed on the first surface of the operation panel board. The waterproof coating layer may include a conformal coating layer.
Implementation Method 2
a fusion protrusion extending from the first front portion, passing through the through-hole, protruding outward from the second surface of the operation panel board, and including a protruding end fused to the second surface.
Data Source
AI summary
An operation panel assembly of the disclosure includes a first cover including a first front portion defining an opening and a first side portion extending from the first front portion, wherein the first front portion and the first side portion form a first accommodation space, an operation panel board including a first surface on which an electronic component aligned with the opening of the first cover is disposed, and a second surface opposite to the first surface and arranged in the first accommodation space so that the first surface faces the first front portion, and a second cover coupled to the first cover to close the first accommodation space.