Operative Devices Encapsulated in Multi-Filament Yarns
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Solution Overview
Problem
Existing methods for integrating operative devices, such as silicon chips, into yarns face challenges during the extrusion process and when the yarn is subjected to flexure, leading to potential damage and instability.
Innovation Solution
The operative devices are encapsulated within a multi-filament yarn using a pultrusion process, where filaments form a capsule around the device with resin, allowing for secure installation and protection, and additional layers can be added for enhanced protection and identification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If operative devices are integrated into individual fibres using extrusion process, then the devices can be incorporated into woven material, but the devices are subject to considerable strain during installation and flexure leading to potential damage
Solution Approach 1:
The operative device is nested within a protective capsule formed by multiple layers of filaments. The device is positioned at the center of the yarn, surrounded by concentric layers of filaments that are bonded together to form a protective structure, allowing the device to be integrated into woven material while protected from strain during installation and flexure
Solution Approach 2:
A composite structure is created combining the operative device with multiple layers of filaments and bonding agent. The bonding agent cures to form a matrix that holds the device and filaments together, creating a composite yarn structure that distributes mechanical strain away from the device while maintaining integrability into woven materials
2Reliability
If operative devices are enclosed in filaments of multifilament fibre, then protection is provided, but the installation process becomes more complex
Solution Approach 1:
The protective capsule structure is prepared in advance by arranging multiple layers of filaments in a predetermined configuration around the operative device before bonding. The filaments are positioned concentrically and the bonding agent is applied in advance, allowing the device to be protected without adding significant complexity to the installation process
Solution Approach 2:
The protective structure is segmented into multiple discrete layers of filaments that can be applied separately. Each layer provides incremental protection, and the segmentation allows for simpler installation compared to forming a single complex protective structure, as each layer can be independently positioned and bonded
3Reliability
If multiple layers of filaments are added around the device, then enhanced protection and identification are achieved, but the yarn structure becomes more complex
Solution Approach 1:
Different layers of filaments are assigned different local qualities and functions. The inner layers provide primary protection, while outer layers provide additional protection and identification features. This local differentiation allows enhanced protection without requiring uniform complexity throughout the entire yarn structure
Solution Approach 2:
The protective structure is organized in concentric layers around the central device, utilizing radial dimensionality. This layered arrangement in three-dimensional space provides enhanced protection through multiple barriers while maintaining a compact, organized structure that is more manageable than random or dispersed configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides effective protection and integration of operative devices within yarns, enabling their use in various fabric forms while maintaining structural integrity, even under flexure and thermal stress, with minimal waste and adaptable power sources.
Implementation Method 1
The resin of the capsule can also be cured around the device
Implementation Method 2
Installation of operative devices in a yarn can be conducted in a pultrusion process
Data Source
AI summary
An operative device, such as an electronic chip, apiezzo-electric, thermal or optical device, is confined within the filaments of a length of multi- filament yarn. The filaments around the device form a capsule and the filaments can be bonded to each other to reinforce such a capsule. The capsule can also comprise a resin to provide protection for the confined device. An additional layer of filaments can be created around the original filaments. Methods and apparatus for confining the devices within yarns are described.