Ophthalmic Lens Wafer Assembly for Curl-Free Thermoset Casting

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Solution Overview

Problem

Current methods for manufacturing thermoset ophthalmic lenses with embedded wafers face issues such as uncontrolled stresses, wafer curling, positioning defects, and non-uniformity due to glue spots, leading to microbubbles and casting defects, while being costly and time-consuming.

Innovation Solution

A method involving affixing a wafer to a mould part using a continuous glue string, forming a cavity, filling it with monomer liquid, and curing simultaneously to create thermoset material portions, ensuring precise positioning and avoiding stress on the wafer, compatible with existing lens mould designs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the wafer is fitted into a groove provided in a gasket, then the wafer is positioned in the lens mould, but uncontrolled stresses are caused in the gasket due to radial expansion

Engineering Contradiction:
Improvewafer positioningVSAvoidgasket stress
Core Design Contradiction:
Manufacturing precisionVSStress or pressure

Solution Approach 1:

The invention removes the gasket component from the lens mould assembly, replacing it with a wafer holder that integrates wafer positioning and mould sealing functions. This extraction eliminates the source of radial expansion stresses while maintaining precise wafer positioning through the holder's designed geometry and wafer attachment mechanism.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the wafer positioning function and the mould sealing function into a single integrated wafer holder structure. This consolidation eliminates the need for separate gasket components that cause stress, while the holder simultaneously secures the wafer and seals the lens mould cavity during the curing process.

Inventive Principle:
Principle #5Merging (Combining)

2Stability of the object's composition

If glue spots are used to secure the wafer to the mould part, then the wafer is fixed, but positioning variations occur leading to microbubbles and casting defects

Engineering Contradiction:
Improvewafer fixationVSAvoidwafer positioning uniformity
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The invention removes the glue spots from the wafer attachment process, replacing them with a mechanical fixation system using the wafer holder. This extraction eliminates the positioning variations and defects associated with glue application while maintaining secure wafer fixation through the holder's clamping or positioning mechanism.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The wafer holder serves as an intermediary device between the wafer and the lens mould, providing a controlled mechanical interface for wafer positioning and fixation. This intermediary structure ensures uniform positioning through its designed geometry, replacing the unreliable glue spot method with a precise mechanical system.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If a clip is used for pressing the mould parts against the gasket, then the mould is sealed, but gasket deformation occurs

Engineering Contradiction:
Improvemould sealingVSAvoidgasket shape
Core Design Contradiction:
ReliabilityVSShape

Solution Approach 1:

The invention removes both the gasket and the clip components from the lens mould assembly, replacing them with an integrated wafer holder that provides sealing through its own structure. This extraction eliminates gasket deformation while maintaining reliable mould sealing, as the holder's design inherently provides the necessary seal without requiring external clamping forces.

Inventive Principle:
Principle #2Taking out (Extraction)

4Ease of manufacture

If the wafer is affixed using glue spots with gaps, then the wafer can be attached to the mould part, but the wafer curls due to internal stresses and thickness variations

Engineering Contradiction:
Improvewafer attachmentVSAvoidwafer flatness
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The invention removes the glue spots from the wafer attachment process and replaces them with a mechanical fixation system using the wafer holder. This extraction eliminates the wafer curling issue caused by glue application while maintaining ease of manufacture through the simplified mechanical attachment process that uniformly distributes fixing forces across the wafer surface.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method produces identical, defect-free ophthalmic lenses without significantly increasing costs or time, using commercially available glue dispensers for controlled wafer positioning and stress-free assembly.

Implementation Method 1

simultaneously curing the first and second monomer-containing liquid amounts contained within the lens mould

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Data Source

PatentEP4650157A1Method for manufacturing an ophthalmic lens including a wafer and two thermoset material portions
Publication Date: 2025.11.19 ESSILOR INTERNATIONAL(COMPAGNIE GENERALE D OPTIQUE)
  • EP4650157A1 patent drawingFigure 1~2b
  • EP4650157A1 patent drawingFigure 3a~3e
  • EP4650157A1 patent drawingFigure 3f~4d

AI summary

A method for manufacturing an ophthalmic lens that includes a wafer (13) and two thermoset material portions comprises forming a sub-assembly that is comprised of one mould part (101), the wafer and a continuous glue string (30). The glue string connects a peripheral edge of the wafer to the mould part, thereby forming a first cavity (C1). Said first cavity is filled with monomer-containing liquid and sealed. The sub-assembly can then be used to form a complete lens mould (100). The method alleviates drawbacks of previous methods, in particular when the wafer spontaneously curls.