Opposed Power Terminals in Semiconductor Devices
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Solution Overview
Problem
Surge voltage generation in semiconductor devices due to abrupt current changes leads to malfunctions and unnecessary power consumption, which existing technologies have not effectively addressed.
Innovation Solution
The semiconductor device design incorporates a first and second power terminal with a plate shape, opposed to each other within an encapsulant, allowing currents to flow in opposite directions, canceling out magnetic fields and reducing inductance, thereby suppressing surge voltage. The encapsulant may include protrusions to maintain insulation and support the terminals, allowing for efficient connection and reduced deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the first power terminal and the second power terminal are arranged close to each other to reduce inductance, then surge voltage is suppressed, but insulation between the terminals may be compromised
Solution Approach 1:
An insulating structure is introduced as an intermediary between the first power terminal and the second power terminal. This insulating structure includes an insulating plate that extends between the terminals and an insulating case that encloses both terminals, maintaining electrical insulation while allowing the terminals to be positioned close together for reduced inductance.
Solution Approach 2:
The insulating structure extends in the thickness direction (vertical dimension) between the terminals, which are arranged in the horizontal plane. By utilizing the vertical dimension for insulation, the terminals can be positioned close horizontally without compromising insulation, thereby reducing inductance while maintaining safety.
2Reliability
If the power terminals are positioned close together to reduce inductance, then magnetic fields cancel out more effectively, but the structural complexity increases
Solution Approach 1:
The insulating plate and insulating case are merged into a unified insulating structure that performs multiple functions: providing electrical insulation between terminals, mechanically supporting the terminals, and maintaining their precise relative positioning. This integration reduces the number of separate components and simplifies the overall structure.
Solution Approach 2:
The insulating structure serves multiple functions simultaneously: it acts as an electrical insulator, a mechanical support for the terminals, and a positioning element that maintains the optimal distance between terminals for inductance reduction. This multi-functionality reduces the need for additional separate components.
3Reliability
If the power terminals are made with plate shape and opposed to each other, then inductance is significantly reduced, but manufacturing precision requirements increase
Solution Approach 1:
The insulating structure is designed with pre-formed positioning features such as recesses and protrusions that guide the first and second power terminals into their correct opposed positions during assembly. This preliminary preparation of positioning features ensures accurate alignment without requiring high-precision machining of the terminals themselves.
Solution Approach 2:
The insulating structure acts as a mediator that defines and maintains the precise spatial relationship between the opposed power terminals. By incorporating positioning features in the insulating structure rather than requiring direct precision between terminals, the manufacturing complexity is reduced while maintaining the necessary positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces inductance and surge voltage, enhancing the semiconductor device's reliability and efficiency by maintaining insulation and facilitating easy connection of external members, while supporting the terminals to prevent deformation.
Implementation Method 1
a magnetic field that is generated by the current through the first power terminal and a magnetic field that is generated by the current through the second power terminal cancel out each other
Data Source
AI summary
A semiconductor device may include at least one semiconductor chip, an encapsulant encapsulating the at least one semiconductor chip, a first power terminal connected to the at least one semiconductor chip within the encapsulant, and a second power terminal electrically connected to the first power terminal via the at least one semiconductor chip within the encapsulant. The first power terminal and the second power terminal each may have a plate shape and may be at least partly opposed to each other within the encapsulant