Semiconductor Power Module Terminal Layout to Suppress Surge Voltage
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Solution Overview
Problem
Semiconductor power modules face issues with surge voltage generation due to increased mutual inductance components between power supply terminals, which are not adequately canceled out, leading to potential inefficiencies and potential damage.
Innovation Solution
The semiconductor power module design arranges power supply terminals on opposite surfaces of an insulating substrate, allowing for proximity while maintaining insulation, thereby canceling out magnetic fields and reducing mutual inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power supply terminals are arranged at one end portion of the resin case across a large interval, then insulation is maintained, but mutual inductance increases and surge voltage is generated
Solution Approach 1:
The patent transitions from a planar arrangement of terminals to a three-dimensional configuration where terminals are positioned on opposite surfaces of the insulating substrate. This spatial reconfiguration reduces the distance between terminals while maintaining insulation, effectively canceling magnetic fields and reducing mutual inductance without compromising insulation performance
Solution Approach 2:
The patent utilizes the magnetic fields generated by the power supply terminals to cancel each other out. By positioning terminals to face each other across the insulating substrate, the opposing magnetic fields interfere destructively, converting the potentially harmful mutual inductance effect into a beneficial field cancellation that reduces surge voltage
2Object-affected harmful factors
If power supply terminals are arranged in proximity, then mutual inductance is reduced, but insulation may be compromised
Solution Approach 1:
The insulating substrate serves as an intermediary element positioned between the power supply terminals. This substrate provides the necessary electrical insulation while allowing the terminals to be arranged in a configuration that enables magnetic field cancellation, thus mediating between the requirements for both insulation and reduced mutual inductance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces inductance components, suppresses temperature rises, and enhances the efficiency and reliability of the semiconductor power module by minimizing surge voltage effects.
Implementation Method 1
A magnetic field generated at the first power supply terminal and a magnetic field generated at the second power supply terminal can thus be canceled out satisfactorily
Implementation Method 2
a mutual inductance component between the terminals is thus likely to increase due to a mutual induction effect
Data Source
AI summary
A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at an other surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.