Opposing Circuit Boards Stacked with Molding Material
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Solution Overview
Problem
Traditional circuit board arrangements, such as open face designs, face increasing yield losses, reliability failures, and performance degradations as component density increases, and rely on expensive underfill materials to enhance robustness.
Innovation Solution
The solution involves stacking two circuit boards with interposers providing mechanical and electrical connections, and filling the gap between them with a molding material, such as an epoxy molding compound, to create a more robust and flexible system-in-package structure that eliminates the need for underfilling and enhances signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional open face circuit board designs are used, then ease of manufacture is maintained, but reliability deteriorates due to yield losses and performance degradations as component density increases
Solution Approach 1:
The patent combines multiple circuit boards into a single stacked assembly with opposing boards facing each other, merging what were previously separate manufacturing processes into one integrated structure. This stacking approach improves reliability by reducing yield losses while maintaining manufacturing feasibility through standardized assembly processes.
Solution Approach 2:
The invention transitions from traditional planar circuit board layouts to a three-dimensional stacked configuration where circuit boards are arranged in opposing layers. This dimensional change allows for better space utilization and improved reliability without significantly increasing manufacturing complexity.
2Volume of moving object
If component density is increased to make products smaller, then volume is reduced, but reliability deteriorates due to yield losses and performance degradations
Solution Approach 1:
The patent utilizes vertical stacking of circuit boards in opposing layers, transitioning from two-dimensional planar arrangements to three-dimensional configurations. This enables higher component density and reduced volume while maintaining reliability through the structural benefits of the stacked architecture.
Solution Approach 2:
The invention nests components and circuit boards within each other in a stacked configuration, with opposing circuit boards positioned face-to-face. This nesting approach maximizes space utilization, reducing overall volume while maintaining reliable electrical connections and signal integrity.
3Strength
If underfill materials are used to enhance robustness, then strength is improved, but cost increases due to expensive underfill materials
Solution Approach 1:
The patent extracts and eliminates the need for expensive underfill materials by using an alternative structural approach. The opposing circuit board configuration with proper spacing and support structures provides the necessary mechanical strength and robustness without requiring additional costly materials.
Solution Approach 2:
The invention replaces expensive underfill materials with a more cost-effective structural design using standard circuit board materials and assembly techniques. The opposing board configuration provides equivalent or superior strength without the need for specialized costly materials.
4Strength
If circuit boards are stacked with gap filling, then mechanical robustness is improved, but manufacturing complexity increases due to molding process requirements
Solution Approach 1:
The patent combines the circuit boards into a stacked assembly where the gap between opposing boards is filled with molding material, merging multiple components into one robust integrated structure. This improves mechanical robustness while the molding process, though added, is a standard manufacturing technique.
Solution Approach 2:
The invention uses composite construction by filling the gap between opposing circuit boards with molding material, creating a composite structure that enhances mechanical robustness. The combination of circuit boards and molding material provides superior strength and structural integrity.
Data Source
AI summary
System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.