Opposing Part Cleaning via Overflow Rinsing in Substrate Processing

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Solution Overview

Problem

Conventional substrate processing technologies face challenges in effectively cleaning the opposing parts under substrates during processing, as processing liquid can solidify and contaminate the substrate, and existing cleaning methods are not always thorough.

Innovation Solution

A substrate processing device with a first supply unit for processing liquid on the substrate's lower surface and a second supply unit for rinsing liquid on a concave surface of the opposing part, utilizing a tapered surface for efficient liquid flow and overflow to remove contaminants, along with a third supply unit for gas to aid in cleaning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If cleaning liquid is supplied to the central part of the upper surface of the opposing part, then cleaning processing is performed, but the processing liquid resides at the upper surface and cleaning is not thorough

Engineering Contradiction:
Improvecleaning accuracyVSAvoidcontamination risk
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The upper surface of the opposing part is divided into distinct functional zones: a concave surface (recessed portion) for collecting rinsing liquid and a tapered surface for directing flow. This segmentation allows different regions to perform different cleaning functions, improving overall cleaning effectiveness by preventing liquid residence and enabling thorough contaminant removal.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention introduces a vertical dimension to the cleaning process by creating a concave surface that collects rinsing liquid from the tapered surface. This three-dimensional structure enables gravity-driven liquid flow from higher to lower regions, ensuring continuous movement of cleaning liquid and preventing stagnation, thereby eliminating residual processing liquid that would otherwise remain on a flat surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the first opening height is higher than the rinsing liquid surface height, then overflow cleaning is achieved, but device complexity increases

Engineering Contradiction:
Improvecleaning accuracyVSAvoidstructural complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The first opening is positioned at a height above the maximum liquid surface level in the concave surface, creating an equipotential arrangement where gravity naturally drives liquid overflow. This height differential establishes a passive flow system that eliminates the need for additional pumps or complex control mechanisms, achieving thorough cleaning through simple gravitational potential energy differences.

Inventive Principle:
Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables highly accurate cleaning of the opposing parts by ensuring thorough removal of contaminants, reducing the risk of re-contamination and improving processing efficiency by using overlapping supply periods and specific liquid and gas distributions.

Implementation Method 1

a height of the first opening is higher than a height of a liquid surface, of the rinsing liquid supplied to the concave surface, when the rinsing liquid overflows the opposing part

Methodology Applied
Scientific EffectGravity: Gravitation

Implementation Method 2

the upper surface of the opposing part further includes, on an outer circumference side of the concave surface, a tapered surface which is inclined in an obliquely downward direction toward an outer circumferential edge

Methodology Applied
Scientific EffectFluid flow:

Data Source

PatentUS10573523B2Substrate processing device which performs processing on substrate
Publication Date: 2020.02.25 SCREEN HOLDINGS CO LTD
  • US10573523B2 patent drawing
  • US10573523B2 patent drawing
  • US10573523B2 patent drawing

AI summary

A substrate processing device includes: a substrate holding member which horizontally holds a substrate; a first supply unit which has a first opening opposed to a lower surface of the substrate held by the substrate holding member and supplies fluid from the first opening toward the lower surface of the substrate; an opposing part having an upper surface opposed to the lower surface of the substrate held by the substrate holding member; and a second supply unit which supplies rinsing liquid from a second opening to a concave surface which is recessed on a central side in the upper surface of the opposing part. A height of the first opening is higher than a height of a liquid surface, of the rinsing liquid supplied to the concave surface, when the rinsing liquid overflows the opposing part. Therefore, the opposing part can be highly accurately cleaned.