Opposing Planar Conductive Surfaces for Component Carrier Signal Integrity
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Solution Overview
Problem
Existing component carriers face challenges in managing heat dissipation, mechanical robustness, electrical reliability, and signal interference, particularly in high-frequency applications, due to issues with signal reflection and mixing of high-frequency signals, which degrade performance.
Innovation Solution
A component carrier with a two-dimensional electrically conductive connection between planar surfaces, using preformed connection bodies that are mechanically coupled and optionally combined with impedance matching, replacing conventional vias to enhance electrical connectivity and reduce signal reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vias are used to connect component carrier stacks, then electrical connection is established, but signal reflection and mixing occur degrading high-frequency performance
Solution Approach 1:
The patent transitions from conventional point-like vias to planar two-dimensional connection areas. The opposing planar electrically conductive surfaces create a distributed connection interface that reduces signal reflection and mixing by spreading the electrical connection over a larger area, thereby improving high-frequency signal integrity while maintaining electrical reliability.
Solution Approach 2:
The patent divides the electrical connection into multiple planar contact regions between opposing conductive surfaces. This segmentation of the connection interface reduces the concentration of electromagnetic fields at single points, thereby minimizing signal reflection and mixing effects while maintaining overall electrical connectivity.
2Reliability
If component carriers are designed for high-frequency applications, then signal transmission quality improves, but heat dissipation becomes increasingly difficult
Solution Approach 1:
The patent merges electrical connection functions with thermal management functions by creating planar conductive surfaces that serve dual purposes. The extended conductive areas not only provide improved electrical connectivity for high-frequency signals but also act as heat dissipation pathways, conducting heat away from active components more effectively than conventional vias.
3Reliability
If two-dimensional planar connection surfaces are used, then signal reflection is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs planar conductive surfaces that are already present in the component carrier stacks for electrical connection purposes. These surfaces serve multiple functions: providing electrical connectivity, reducing signal reflection, and facilitating thermal management. This multi-functionality approach avoids adding separate structures, thereby limiting the increase in manufacturing complexity.
Data Source
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AI summary
A component carrier (100) which comprises a first stack (102) comprising at least one first electrically insulating layer structure (104) and at least one first electrically conductive layer structure (106) having a first connection body (110) with a first exposed planar electrically conductive surface (108), and a second stack (112) comprising at least one second electrically insulating layer structure (114) and at least one second electrically conductive layer structure (116) having a second connection body (120) with a second exposed planar electrically conductive surface (118), wherein the first stack (102) and the second stack (112) are connected with each other so that the first exposed planar electrically conductive surface (108) and the second exposed planar electrically conductive surface (118) are connected to establish a vertical two-dimensional electrically conductive connection.