Opposing Spring Heat-Removal Assemblies for Thermal Coupling
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Solution Overview
Problem
Existing heat-removal assemblies for electronic devices fail to effectively press against heat-generating assemblies without deforming the device, leading to inefficient heat dissipation and potential damage.
Innovation Solution
The use of springs on opposing sides of a support structure, anchored via a circuit board passageway, to exert even pressure on a heat-dissipating subassembly against a heat-generating assembly, minimizing deformation and enhancing thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat-removal assembly presses against a heat-generating assembly, then thermal coupling is improved, but the electronic device deforms
Solution Approach 1:
The patent transitions from a single-sided pressing mechanism to a dual-sided opposing spring mechanism. By positioning springs on both sides of the circuit board and anchoring them through passageways, the system applies pressure from multiple dimensions simultaneously, achieving effective thermal coupling while distributing mechanical stress to prevent device deformation
Solution Approach 2:
The patent modifies the mechanical pressure application parameters by using spring-based mechanisms with controlled force characteristics. The opposing springs provide adjustable, distributed pressure that maintains optimal thermal contact between the heat-removal assembly and heat-generating assembly while preventing excessive force that would cause device deformation
2Productivity
If pressure is applied to improve heat dissipation, then heat removal efficiency increases, but device structural integrity deteriorates
Solution Approach 1:
The system moves from unidirectional pressure application to bidirectional opposing forces. By anchoring springs through circuit board passageways from both sides, the structure distributes loading across multiple dimensional planes, maintaining heat removal efficiency while preserving structural integrity through balanced force distribution
Solution Approach 2:
The opposing spring mechanism creates counterbalancing forces on either side of the circuit board. The springs act as counterweights to each other, with one spring's compressive force balanced by the other spring's opposing force, thereby maintaining structural equilibrium while enabling effective heat dissipation pressure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures robust thermal coupling and efficient heat removal while preventing deformation of the electronic device, maintaining its structural integrity and enhancing heat dissipation efficiency.
Implementation Method 1
a first spring structure including a first spring anchor and a first spring contact, and second spring structure including a second spring anchor and a second spring contact
Data Source
AI summary
Heat-removal assemblies with springs on opposing sides of a support structure and methods for using the same are provided. Heat may be removed from a heat-generating assembly of an electronic device by a heat-removal assembly that may include a heat-dissipating subassembly (e.g., a heat spreader and/or a heat pipe) and a fastener subassembly. The fastener subassembly may be configured to press the heat-dissipating subassembly against the heat-generating assembly for enabling the heat-dissipating subassembly to be thermally coupled to the heat-generating assembly for removing heat therefrom. In order for the fastener subassembly to provide an even pressure distribution across the heat-dissipating subassembly for such heat removal and/or to limit deformation of one or more portions of the electronic device during such heat removal, the fastener subassembly may include two springs positioned on opposite sides of a circuit board that may be supporting the heat-generating assembly.