Opposite-Direction IC Chip Pairing for Compact Package Design
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Solution Overview
Problem
In the semiconductor industry, packaging multiple integrated circuit (IC) dies on a single carrier poses challenges in minimizing the package structure's dimensions while ensuring effective electrical connection and heat dissipation.
Innovation Solution
A chip package structure is designed with a pair of identical IC chips disposed in opposite directions and parallel to each other on the carrier, connected via wire bonding technology, optimizing the arrangement to reduce signal delay, power consumption, and package thickness by distributing pads and conductive wires efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple IC dies are packaged on a single carrier, then the productivity and integration density are improved, but the package dimension and timing skew increase
Solution Approach 1:
The patent transitions from horizontal arrangement of multiple chips to a vertical stacked configuration, utilizing the Z-dimension (thickness direction) to accommodate multiple IC dies. This dimensional change allows higher integration density without increasing the planar package footprint, effectively resolving the contradiction between productivity and package dimension.
Solution Approach 2:
The patent implements a nested structure where multiple IC dies are stacked vertically one on top of another on the carrier, similar to nested dolls. This nesting approach maximizes space utilization in the vertical direction, enabling multiple chips to be packaged in a compact volume without significantly increasing the overall package dimensions.
2Productivity
If multiple IC dies are packaged on a single carrier, then the integration density is improved, but the timing skew between chips increases
Solution Approach 1:
The patent employs asymmetric arrangement of chips in the stacked configuration, positioning chips at different heights and orientations to optimize signal path lengths. By breaking the symmetry and strategically placing chips at asymmetric positions, the signal transmission distances between chips are balanced, reducing timing skew while maintaining high integration density.
3Area of stationary object
If chips are arranged in opposite directions and parallel to each other, then the space utilization is improved and signal delay is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the multi-chip package into multiple pairs of chips arranged in opposite directions. Each pair is configured independently with parallel orientation, allowing modular manufacturing and assembly. This segmentation approach simplifies the overall manufacturing process by breaking down the complex multi-chip arrangement into manageable units, reducing manufacturing complexity while maintaining efficient space utilization.
Data Source
AI summary
A chip package structure includes a carrier and a chip group. The chip group includes a pair of first chips that are identical IC chips. The pair of first chips are disposed on the carrier in opposite directions and parallel to each other, and electrically connected with the carrier.