Substrate Processing With Opposite Rotation to Reduce Particle Generation
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Solution Overview
Problem
Existing substrate-processing technologies face challenges in suppressing the adhesion of particles onto substrates during film-forming processes due to collisions between the substrate and the inner side surface of the recess in which the substrate is placed.
Innovation Solution
A substrate-processing apparatus and method that involves rotating the rotation table and stage in opposite directions during film formation, reducing the impact of collisions and thereby minimizing particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the rotation table and stage are rotated in the same direction during film-forming process, then the substrate processing is simplified, but particles are generated due to collision between the substrate and the inner side surface of the recess
Solution Approach 1:
The patent applies the inversion principle by rotating the stage in the opposite direction to the rotation table during film-forming processes. This reverse rotation prevents the substrate from colliding with the inner side surface of the recess, thereby eliminating particle generation while maintaining the simplicity of the rotation mechanism
2Object-generated harmful factors
If the rotation table and stage are rotated in opposite directions during film-forming process, then particle adhesion is suppressed, but the control complexity increases
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the rotation direction parameter of the stage based on the process type. During film-forming processes, the stage rotation direction is set opposite to the rotation table, while during other processes it may be set to the same direction. This parameter-based control manages complexity while achieving particle suppression
3Ease of operation
If the substrate is placed in a recess on a rotation table, then the substrate can be processed, but collision between the substrate and recess surface generates particles
Solution Approach 1:
The patent applies dynamics by making the stage rotation direction variable rather than fixed. The stage can rotate in the same or opposite direction to the rotation table depending on the process requirements. This dynamic adjustment allows the substrate to be securely held in the recess during processing while preventing collision-induced particle generation through opposite-direction rotation during film-forming
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses particle adhesion on the substrate, as demonstrated by a significant reduction in particle count compared to conventional methods where the rotation table and stage are rotated in the same direction.
Implementation Method 1
A rotation shaft of the stage is provided at a position that is shifted from a center of the rotation table in a radial direction of the rotation table. The processor is configured to perform a film-forming process of forming a film on the substrate placed in the recess, while maintaining a state in which the rotation table and the stage are being rotated in opposite directions.
Data Source
AI summary
A substrate-processing apparatus includes a vacuum chamber; a rotation table provided in the vacuum chamber; a stage that is rotatable relative to the rotation table and includes a recess in which a substrate is to be placed; and a controller including a memory and a processor connected to the memory. A rotation shaft of the stage is provided at a position that is shifted from a center of the rotation table in a radial direction. The processor is configured to perform a film-forming process of forming a film on the substrate placed in the recess, while maintaining a state in which the rotation table and the stage are being rotated in opposite directions.