Semiconductor Package Layout for Thin Optical-Electronic Modules
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Solution Overview
Problem
Conventional light transmission modules, such as LiFi modules, face challenges due to the large overall thickness resulting from the stacking of optical and electrical modules on different substrates, which does not meet market needs.
Innovation Solution
A semiconductor device package design where the optical device and electronic devices are positioned on opposite surfaces of a substrate with the optical device having a greater power than the electronic devices, and are laterally spaced apart to prevent overheating, using a case for thermal dissipation and electromagnetic interference protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the optical module and electrical module are integrated on different substrates by stacking, then design freedom and thermal interference are improved, but the overall thickness becomes too large
Solution Approach 1:
The patent merges the optical module and electrical module onto a single substrate, eliminating the need for stacking multiple substrates. This integration approach reduces the overall thickness while maintaining design freedom and thermal management capabilities through lateral spacing arrangements.
Solution Approach 2:
Instead of stacking modules vertically on different substrates (z-dimension), the patent transitions to placing both optical and electrical modules on the same substrate plane (x-y dimensions), using lateral spacing to separate them. This dimensional shift reduces overall thickness while preserving thermal isolation.
2Device complexity
If the optical device and electronic device are placed close together on the same substrate, then device complexity is reduced, but thermal interference increases causing overheating
Solution Approach 1:
The patent applies local quality by creating different spatial zones on the substrate: areas with lateral spacing between optical and electrical devices for thermal isolation, and areas with closer proximity for reduced complexity. This localized approach allows simultaneous optimization of both thermal management and integration density.
Solution Approach 2:
The substrate acts as an intermediary element that enables both integration and thermal isolation. By carefully designing the substrate layout with appropriate spacing, it mediates between the conflicting requirements of reducing device complexity and preventing thermal interference.
3Temperature
If the optical device and electronic device are laterally spaced apart, then thermal management is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates spacing design into the preliminary substrate layout stage, defining predetermined spaced-apart positions for optical and electrical devices. This preliminary action establishes thermal management requirements early in the design process, allowing manufacturing systems to be configured accordingly and reducing actual placement precision demands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the module thickness, enhances reliability by preventing overheating of the optical device, and improves thermal management, allowing for a more compact and efficient light transmission module.
Implementation Method 1
A semiconductor device package design where the optical device and electronic devices are positioned on opposite surfaces of a substrate with the optical device having a greater power than the electronic devices, and are laterally spaced apart to prevent overheating
Data Source
AI summary
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.