Opposite-Side Transistor Power Modules for EMI Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power switching circuits experience high levels of electromagnetic interference (EMI) and complexity due to hard-switching, which can lead to circuit instability and component damage, especially at high switching rates.
Innovation Solution
The configuration of electronic components with transistors mounted on opposite sides of a substrate, forming a capacitor that stabilizes voltage and minimizes parasitic inductances, allowing for hard-switching of high voltages and currents at very high switching rates with reduced EMI and ringing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If hard-switching is used to achieve high switching rates, then productivity is improved, but electromagnetic interference increases and circuit stability deteriorates
Solution Approach 1:
A capacitor is introduced as an intermediary component between the voltage source and the switching circuit. This capacitor acts as a local energy reservoir that supplies current during switching transitions, thereby reducing voltage spikes and electromagnetic interference while enabling high-speed hard-switching operation.
Solution Approach 2:
The voltage across the capacitor is maintained within a specific range (20-80% of the voltage source voltage) to optimize the switching performance. By controlling the capacitor voltage parameter, the circuit achieves low EMI and reduced component stress while maintaining high switching rates.
2Productivity
If hard-switching is used to achieve high switching rates, then productivity is improved, but circuit stability deteriorates
Solution Approach 1:
The capacitor serves as a stabilizing intermediary that smooths voltage fluctuations during hard-switching operations. By providing a local energy buffer, it prevents voltage transients from destabilizing the circuit while allowing high-frequency switching.
Solution Approach 2:
The capacitor is pre-charged to a voltage between 20-80% of the source voltage before switching occurs. This beforehand energy storage cushions the circuit against voltage spikes and transient disturbances that would otherwise occur during hard-switching, maintaining stability at high switching rates.
3Device complexity
If conventional power switching circuits are used, then device complexity is low, but electromagnetic interference and component stress increase
Solution Approach 1:
The capacitor performs multiple functions simultaneously: it acts as an energy reservoir for high-speed switching, a voltage stabilizer to reduce EMI, and a stress-reducing element for switching components. This multi-functionality achieves low EMI with minimal additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables stable operation with low EMI and reduced component stress, allowing for successful switching of voltages above 300 Volts at rates of at least 100 Volts/nanosecond and currents of at least 3 Amps, while maintaining circuit stability and performance.
Implementation Method 1
The configuration of electronic components with transistors mounted on opposite sides of a substrate, forming a capacitor that stabilizes voltage and minimizes parasitic inductances
Data Source
AI summary
An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.