Optical Adhesive Bonding for Low-Temperature Electronic Assembly
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Solution Overview
Problem
Existing electronic device manufacturing processes require high-temperature curing of protective adhesives, leading to issues such as yellowing, decreased reflectivity, warping, and increased costs due to longer processing times.
Innovation Solution
The use of a first optical adhesive with a Young's modulus between 10 kPa and 150 kPa, applied at temperatures between 10°C and 70°C, along with a vacuuming step to bond substrates and optical components, and a gap design between reflective structures and electronic components to enhance bonding and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature curing is used for protective adhesive, then bonding strength is improved, but yellowing and warping occur affecting quality
Solution Approach 1:
The patent changes the curing temperature parameter from high temperature to low temperature (10-70°C) to resolve the contradiction. By using a specially formulated optical adhesive that can cure at low temperatures, the bonding strength is maintained while avoiding the harmful effects of yellowing and warping that occur with high temperature curing.
Solution Approach 2:
The patent employs a composite approach by combining specific adhesive materials with vacuuming technology. The optical adhesive is formulated to work effectively at low temperatures, and when combined with vacuuming assistance, achieves proper bonding without high temperature exposure, thus preventing yellowing and warping while maintaining bonding strength.
2Strength
If high temperature curing is used for protective adhesive, then bonding strength is improved, but manufacturing time increases and costs rise
Solution Approach 1:
The patent changes the curing temperature parameter to low temperature (10-70°C), which significantly reduces the curing time compared to high temperature processes. This parameter change enables faster production cycles while maintaining adequate bonding strength, thereby reducing manufacturing time and associated costs.
Solution Approach 2:
The patent replaces the thermal curing mechanism with a vacuuming assistance mechanism. By using vacuuming to remove air bubbles and assist the adhesive bonding process at low temperatures, the need for prolonged high temperature exposure is eliminated, reducing both time and energy costs while achieving effective bonding.
3Illumination intensity
If small gap is maintained between reflective structure and electronic component, then optical effect is improved, but assembly precision requirements increase
Solution Approach 1:
The patent uses a thin film optical adhesive to maintain the small required gap (0.05-0.25 mm) between the reflective structure and electronic component. The adhesive film is thin enough to preserve the optical effect while providing sufficient compliance to accommodate minor positioning variations, thereby reducing the stringency of assembly precision requirements.
Solution Approach 2:
The patent optimizes the gap parameter to a specific range (0.05-0.25 mm) that balances optical performance and assembly feasibility. Within this range, the optical effect is maintained while allowing for practical assembly tolerances. The low-temperature curing process further enables better gap control during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces yellowing and warping, improves bonding efficiency, and shortens processing times while maintaining reflectivity and assembly tolerance, thereby enhancing the quality and yield of electronic devices.
Implementation Method 1
a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component
Implementation Method 2
performing a vacuuming step, wherein a temperature of the vacuuming step ranges between 10° C. and 70° C.
Data Source
AI summary
An electronic device and a method for manufacturing the same are provided. The electronic device includes: a substrate; an electronic component disposed on the substrate; a first optical component disposed on the substrate and the electronic component; and a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component, wherein a Young's modulus of the first optical adhesive ranges between 10 kPa and 150 kPa.