Optical Measurement of Adhesive Thickness Using Inclined Imaging
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Solution Overview
Problem
Existing thickness measurement methods for adhesives in display devices are unreliable, leading to potential bonding defects due to inaccurate thickness determination.
Innovation Solution
A thickness measuring device and method utilizing an imaging unit and data calculating unit to measure the thickness of an inspection layer on a substrate, employing an inclined imaging angle and refractive index calculations to determine thickness based on light path differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thickness measurement methods are used for adhesives in display devices, then the measurement process is simple, but the measurement reliability is poor leading to bonding defects
Solution Approach 1:
The patent replaces conventional mechanical or contact-based thickness measurement methods with an optical imaging system. The imaging unit captures images of the adhesive layer from above, and the data calculating unit processes these images to determine thickness values, eliminating the need for physical contact with the adhesive and improving measurement reliability without requiring complex mechanical measurement apparatus
Solution Approach 2:
The patent creates an optical copy (image) of the adhesive layer and its underlying pattern, then analyzes this copy to determine thickness. The imaging unit produces inspection image data that represents the adhesive layer's appearance and refractive effects, which are then processed to extract thickness information without directly measuring the physical adhesive
2Measurement precision
If an imaging unit is used to measure adhesive thickness, then measurement reliability improves, but the device complexity increases
Solution Approach 1:
The imaging unit serves multiple functions: it captures images of the adhesive layer, records the underlying pattern, and provides data for thickness calculation. This single imaging device performs what would otherwise require multiple specialized measurement instruments, reducing overall system complexity while maintaining high measurement precision through multi-purpose utilization
Solution Approach 2:
The pattern on the substrate acts as an intermediary element that enables thickness measurement. By observing how the adhesive layer refracts light and distorts the underlying pattern in the captured image, the system can calculate thickness without directly measuring the adhesive itself. The pattern serves as a reference that mediates between the imaging system and the adhesive layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability of thickness measurement by simplifying the process and reducing costs through precise calculation of adhesive layer thickness, thereby preventing bonding defects.
Implementation Method 1
the data calculating unit may calculate the thickness value of the inspection layer using a coordinate value of the pattern from the inspection image data
Implementation Method 2
d is a light path difference corresponding to a difference between the first coordinate value and the second coordinate value
Data Source
AI summary
A thickness measuring device includes an imaging unit disposed above an inspection substrate, which includes a substrate, a pattern provided on the substrate, and an inspection layer disposed on the pattern. The imaging unit images the inspection substrate to output inspection image data and a data calculating unit receives the inspection image data and calculates a thickness value of the inspection layer from the inspection image data, wherein the imaging unit is disposed inclined at a fixed angle with respect to the inspection substrate, and wherein the data calculating unit calculates the thickness value of the inspection layer using a coordinate value of the pattern from the inspection image data.