Optical Detection Alignment Using Multi-Height Adjustment Marks
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Solution Overview
Problem
In the semiconductor industry, achieving precise alignment of substrates during bonding is hindered by the imprecise positioning of optical detection means relative to the substrate holder, leading to alignment errors and increased rejection rates due to parasitic movements and tilted detection axes.
Innovation Solution
A device and method that adjust the detection means relative to the substrate holder using adjustment marking fields with marks at different heights, allowing for precise alignment and compensation of wedge errors without additional measurement systems, enabling accurate alignment and reducing alignment errors by eliminating angular errors in the detection means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical detection means are used to detect alignment marks on substrates, then alignment can be performed, but the detection means are positioned imprecisely relative to the substrate holder, leading to alignment errors
Solution Approach 1:
An adjustment marking field is introduced as an intermediary element on the substrate holder to mediate between the detection means and the substrate. This marking field provides reference marks that enable precise determination and adjustment of the detection means position relative to the substrate holder, eliminating the need for direct positioning of the detection means on the substrate holder.
Solution Approach 2:
The adjustment marking field creates a reference copy or model of the desired positional relationship between the detection means and the substrate holder. By detecting the position of marks in this marking field, the system can determine and correct angular and positional deviations without requiring direct measurement of the detection means itself.
2Measurement precision
If the detection means position is adjusted to improve alignment accuracy, then measurement precision improves, but parasitic movements and tilted detection axes occur, worsening reliability
Solution Approach 1:
The system uses the adjustment marking field to provide feedback on the actual position and orientation of the detection means relative to the substrate holder. By detecting the positions of marks in the marking field and comparing them to expected positions, the system can identify deviations and compensate for them through calculated correction values, stabilizing the detection process.
Solution Approach 2:
The system changes the parameter being measured from the direct position of the detection means to the relative positions of marks in the adjustment marking field. This parameter transformation allows the system to account for and compensate for parasitic movements and tilted axes by calculating correction values based on mark position deviations.
3Measurement precision
If additional measurement systems are used to correct detection means positioning, then alignment accuracy improves, but device complexity increases
Solution Approach 1:
The adjustment marking field serves multiple functions: it provides reference marks for determining the position of the detection means, enables calculation of angular deviations (wedge errors), and facilitates determination of correction values. This single multi-functional element replaces the need for separate measurement systems for each of these functions.
Solution Approach 2:
The adjustment marking field combines multiple reference elements into a single integrated structure on the substrate holder. By merging the reference marks for position and orientation determination into one marking field, the system achieves precise alignment functionality without adding separate measurement devices or systems.
Data Source
AI summary
The invention relates to a method and a device for adjusting a detection means with the aid of adjustment marks arranged one above the other.