Optical Alignment Connector With Contact Plane Against Curing Drift
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Solution Overview
Problem
Existing connecting devices for optical systems face challenges in achieving precise alignment due to curing drift caused by glue shrinkage, which affects image quality, especially with smaller pixel sizes, and often require low-shrink glues that may compromise on other essential properties or increase complexity and cost.
Innovation Solution
A connecting device with a main body and contact plane that allows six degrees of freedom alignment, using a force-exerting mechanism to maintain parallel contact with the receiving member, enabling precise alignment and minimizing glue distribution asymmetry, thus reducing curing drift, and allowing for various force types and materials like metal, polymers, or ceramics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a pin through hole construction is used for alignment, then freedom of movement for alignment is achieved, but curing drift occurs due to glue shrinkage causing image misalignment
Solution Approach 1:
A connecting device with a contact plane is introduced as an intermediary between the pin and the receiving member. This contact plane provides a stable reference surface that maintains parallelism during alignment and curing, preventing the pin from shifting while still allowing initial freedom of movement for positioning.
Solution Approach 2:
The connecting device establishes a predetermined parallel contact plane before curing occurs. This preliminary structural constraint ensures that when glue is applied and cures, the components maintain their aligned positions, preventing curing drift from causing misalignment.
2Manufacturing precision
If low shrink glue is used to reduce curing drift, then alignment stability is improved, but other important glue properties such as strength and thermal expansion may be compromised
Solution Approach 1:
Instead of relying on low-shrink glue to prevent curing drift, the invention uses a connecting device with a contact plane that mechanically prevents drift. This converts the harmful effect of glue shrinkage into a non-issue, allowing the use of high-performance glue with better strength and thermal properties without compromising alignment stability.
3Manufacturing precision
If glue layer thickness is reduced to minimize curing drift, then alignment precision is improved, but manufacturing tolerances and freedom of movement are compromised
Solution Approach 1:
The alignment function is segmented into two independent parts: the connecting device with contact plane that provides mechanical stability and parallelism, and the glue layer that provides bonding. This separation allows the glue layer to be thicker for manufacturing tolerance accommodation while the contact plane ensures alignment precision is maintained.
4Manufacturing precision
If pixel size is reduced to improve image quality, then resolution is improved, but curing drift has increased impact on image quality
Solution Approach 1:
The connecting device with its rigid contact plane provides beforehand cushioning against curing drift. By establishing a mechanically stable parallel reference surface before curing begins, the system protects against the increased impact of curing drift that would otherwise affect smaller pixel sizes, allowing high-resolution imaging without sacrificing alignment stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high accuracy and stability in connecting optical components, reducing curing drift and maintaining alignment precision, while allowing flexibility in design and material selection, thus enhancing image quality and reducing complexity and cost.
Implementation Method 1
The system further comprises means for exerting a force between the contact plane of the connecting device and the receiving planar surface of the receiving member
Data Source
Figure 1~2
Figure 3~4
Figure 5a~5c
AI summary
A device, system and method are described to connect a receiving member (18) and a connecting device (10) with a pin (21) such that an asymmetrical configuration after the alignment of the connecting member and the receiving member does not give rise to asymmetrical glue distribution, nor asymmetrical shrinking nor curing drift. The receiving member has a receiving planar surface with at least one opening, and the connecting device has a main body with a contact plane, said main body having at least one opening whereby the connecting device is placed with the contact plane towards the receiving planar surface so that the at least one opening of the connecting device overlaps the at least one opening of the receiving surface, and the pin is inserted into said overlap, said system further comprising means for exerting a force between the contact plane of the connecting device and the receiving planar surface of the receiving member.