Optical Semiconductor Alignment Structure With Etch-Stop Layer

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Solution Overview

Problem

Existing optical integrated elements face challenges in ensuring precise positional alignment between optical semiconductor elements and other component parts, leading to potential degradation in optical coupling efficiency and stability.

Innovation Solution

The optical semiconductor element incorporates protrusion parts and a first semiconductor layer that serves as an etching stop layer, allowing for precise positioning and preventing etching residue, thereby enhancing alignment precision and mechanical stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional etching processes are used without an etching stop layer, then the etching process is simpler, but etching residue remains and positional alignment precision deteriorates

Engineering Contradiction:

Improvepositional alignment precisionVSAvoidlayer structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The first semiconductor layer is formed as an etching stop layer before the etching process to prevent etching residue and ensure precise positional alignment. This preliminary structural preparation eliminates the need for complex post-etching alignment adjustments while maintaining manufacturing precision.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If the first semiconductor layer is etched by the prescribed etching agent, then the etching process is more aggressive, but etching residue increases and alignment precision deteriorates

Engineering Contradiction:

Improveetching rateVSAvoidpositional alignment precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The first semiconductor layer acts as an intermediary etching stop layer between the etching agent and the underlying structures. It enables controlled etching by stopping the etching process at the precise location, preventing etching residue while maintaining high etching rates without compromising alignment precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If protrusion parts are not formed, then the structure is simpler, but positional alignment between optical semiconductor element and other components cannot be guaranteed

Engineering Contradiction:

Improvepositional alignment precisionVSAvoidstructure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The optical semiconductor element is segmented into distinct functional regions including the first protrusion part for optical functions and the second protrusion part for positional alignment. This segmentation allows the second protrusion part to serve as a dedicated alignment reference without interfering with the optical functions of the first protrusion part.

Inventive Principle:

Principle #1Segmentation

4Reliability

If the first semiconductor layer is not formed as an etching stop layer, then the manufacturing process is simpler, but etching residue remains and leakage currents occur

Engineering Contradiction:

Improveprevention of leakage currentsVSAvoidmanufacturing process simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The first semiconductor layer is extracted as a distinct etching stop layer with specific material properties that prevent etching residue formation. This extracted layer also serves to block leakage currents by providing a clean stopping point for the etching process, eliminating the need for additional residue removal steps.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables more precise and stable positional alignment, preventing optical coupling efficiency degradation and leakage currents, while maintaining mechanical strength and compactness in the optical integrated element.

Implementation Method 1

a first semiconductor layer formed throughout a first section positioned behind the first protrusion part in the first direction, a second section positioned behind the second protrusion part in the first direction, and a third section positioned between the first section and the second section, the first semiconductor layer either: not getting etched by a prescribed etching agent capable of etching another semiconductor layer; or having a sufficiently small ratio between an etching rate thereof and an etching rate of said another semiconductor layer

Methodology Applied

Scientific EffectEtching stop layer effect:

Data Source

PatentUS20240380176A1Optical semiconductor element, optical integrated element, and method for manufacturing optical semiconductor element

Publication Date: 2024.11.14 FURUKAWA ELECTRIC CO LTD

AI summary

An optical semiconductor element includes: a substrate expanding while intersecting a first direction; a first protrusion part protruding from the substrate in the first direction and including semiconductor layers including an active layer; a second protrusion part protruding from the substrate in the first direction, in a position apart from the first protrusion part in a second direction intersecting the first direction, the second protrusion part including a semiconductor layer, and being configured to function as a position determining part used for determining a position relative to a component part different from the optical semiconductor element; and a first semiconductor layer formed throughout a first section positioned behind the first protrusion part in the first direction, a second section positioned behind the second protrusion part in the first direction, and a third section positioned between the first section and the second section.