Integrated Optical Alignment and Parallelism Measurement
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Solution Overview
Problem
Conventional methods for measuring alignment and parallelism in semiconductor devices require separate devices and systems, leading to increased time and reduced accuracy due to environmental factors like vibration and temperature changes.
Innovation Solution
An optical measuring device with integrated imaging and parallelism optical systems that measure alignment and parallelism simultaneously using shared light paths, reducing environmental impact and improving accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate devices and systems are used to measure alignment and parallelism, then the measurement process can be completed using conventional methods, but the total measurement time increases and accuracy decreases due to environmental factors
Solution Approach 1:
The patent combines the imaging optical system for alignment measurement and the parallelism optical system for parallelism measurement into a single integrated optical measuring device. Both systems share common components including light sources, optical paths, and a camera, allowing simultaneous measurement of alignment and parallelism without requiring separate devices or sequential operations, thereby reducing total measurement time while maintaining measurement accuracy through a unified stable optical platform
2Reliability
If separate optical systems are used for alignment and parallelism measurement, then each system can be independently configured, but environmental factors such as vibration and temperature changes affect measurement accuracy
Solution Approach 1:
By merging both measurement systems into a single integrated device with shared optical components and a common stable platform, the patent minimizes the impact of environmental factors. The unified structure ensures that vibration and temperature changes affect both measurement paths equally, allowing for differential compensation and maintaining measurement reliability
Solution Approach 2:
The patent introduces a stable platform as a common intermediary structure that supports both the imaging optical system and the parallelism optical system. This shared platform acts as a mediator that isolates both measurement systems from external environmental disturbances, providing a stable reference frame for accurate simultaneous measurements
3Device complexity
If separate measuring systems are used, then system configuration is simpler for each individual system, but the overall device complexity increases due to multiple independent systems
Solution Approach 1:
The patent merges the imaging optical system and parallelism optical system into a single integrated device with shared components including light sources, optical paths, and a camera. This consolidation reduces the number of independent systems from two to one, decreasing overall device complexity while enabling simultaneous measurement operations that reduce total measurement time
4Measurement precision
If alignment and parallelism are measured at different positions and times, then separate measurement setups can be used, but measurement accuracy decreases due to positioning errors and environmental changes
Solution Approach 1:
The integrated optical measuring device combines alignment and parallelism measurement functions into a single system that operates from the same measurement position. The shared optical platform and simultaneous operation eliminate positioning errors between separate measurements and prevent environmental changes from affecting measurements taken at different times, thereby improving both measurement precision and subsequent bonding accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device shortens measurement time and enhances accuracy by minimizing the effects of environmental changes, ensuring high reliability and improved bonding precision in semiconductor devices.
Implementation Method 1
a first dichroic mirror positioned in a first light path of the first illumination light; a second dichroic mirror positioned in a second light path of the second illumination light
Implementation Method 2
a folding mirror positioned in the first light path and in the second light path
Implementation Method 3
a second polarization beam splitter configured to split the polarized light into a reference light and a measuring light
Data Source
AI summary
An optical measuring device includes a first optical system for measuring a first alignment mark of a first object using a first illumination light, and for measuring a second alignment mark of a second object facing the first object using a second illumination light; and a second optical system for measuring the parallelism of the first object and the second object using a reference light and a measuring light. The first optical system includes a first dichroic mirror arranged in the first light path of the first illumination light; a second dichroic mirror arranged in the second light path of the second illumination light; and a folding mirror arranged in the first light path and the second light path. The second optical system includes the first dichroic mirror, the second dichroic mirror, and the folding mirror arranged on a third light path of the measuring light.