Optical Assembly Alignment Structure Using Positioning Posts
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Solution Overview
Problem
The high cost and time-consuming calibration process of silicon chip packaging in optical signal transmission components, particularly due to the expensive silicon wafers required for larger area silicon chips, hinder efficient data transmission.
Innovation Solution
An assembly alignment structure comprising a cover plate, a carrier plate, and positioning columns, with guide grooves and coupling grooves, allows for quick and accurate alignment of optical fibers and chips, reducing material costs and assembly time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional silicon chip packaging alignment method is used, then alignment precision can be achieved, but calibration and alignment time is too long and cost is high
Solution Approach 1:
The patent applies preliminary action by pre-designing positioning structures (positioning holes, positioning protrusions, guide grooves) on the silicon chip and packaging substrate before the actual packaging process. These pre-formed structures enable automatic alignment during assembly, eliminating the need for time-consuming post-assembly calibration and alignment operations, thus resolving the contradiction between alignment precision and calibration time
Solution Approach 2:
The patent implements self-service alignment through self-aligning structures where the positioning holes on the substrate and positioning protrusions on the chip automatically locate each other during the packaging process. The guide grooves further assist this self-alignment mechanism, allowing the system to achieve precise alignment without external intervention or lengthy calibration procedures
2Ease of operation
If larger area silicon wafer is used for chip with alignment structure, then assembly alignment can be improved, but material cost increases
Solution Approach 1:
The patent applies segmentation by dividing the alignment function into two parts: positioning structures (holes/protrusions) on the silicon chip and corresponding coupling structures on the packaging substrate. This segmentation allows the use of smaller, more cost-effective silicon wafers while maintaining alignment capability, as the positioning structures provide reference points that eliminate the need for large wafer areas
Solution Approach 2:
The patent introduces positioning holes and guide grooves as intermediary structures that mediate between the silicon chip and packaging substrate. These intermediaries provide the alignment function without requiring the silicon wafer itself to be large, thus reducing material cost while maintaining ease of assembly alignment
3Ease of manufacture
If optical fiber and chip assembly is performed without positioning structure, then manufacturing process is simpler, but assembly precision and efficiency are reduced
Solution Approach 1:
The patent merges the alignment function with the packaging structure itself by integrating positioning holes, positioning protrusions, and guide grooves into the packaging substrate and chip design. This merging allows the same structure to serve both manufacturing simplicity (by being part of the standard packaging process) and high assembly efficiency (through automatic alignment), resolving the contradiction between process simplicity and productivity
Data Source
AI summary
An assembly alignment structure for optical component includes an optical fiber comprising a combined fiber segment and a plurality of bare fiber segments; a cover plate having a first installation surface disposed with a plurality of guide grooves, an installation groove, and at least one first coupling groove, the bare fiber segments being in the corresponding in the guide grooves; a lens arranged in the installation groove; a chip having a signal receiving surface; a carrier plate having a second installation surface disposed with at least one second coupling groove, the chip being fixed on the second installation surface; and at least one positioning post. When the cover plate and carrier plate are aligned, the positioning post is located in the first and second coupling grooves, and the optical fiber and the lens are fixed and aligned between the carrier plate and the cover plate.