Optical Element Array Dicing Based on Wafer Defect Inspection
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Solution Overview
Problem
In array device manufacturing, the presence of defective optical elements in a wafer leads to reduced yields as the entire array device is deemed defective, resulting in inefficiencies and waste.
Innovation Solution
A method and apparatus for inspecting optical elements on a wafer, defining dicing lines based on inspection results to exclude defective elements, and forming array devices solely from non-defective optical elements, ensuring that only non-defective elements are included in the final array device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional dicing methods are used without inspection, then manufacturing process is simple and fast, but yields are reduced due to defective optical elements being included in array devices
Solution Approach 1:
The patent applies preliminary action by performing inspection of optical elements before the dicing process. The inspection unit detects defective optical elements on the wafer prior to cutting, and the dicing lines are determined based on these inspection results. This ensures that array devices are formed only from non-defective optical elements, thereby improving manufacturing yield without significantly complicating the overall process flow.
2Reliability
If dicing lines are defined to exclude all defective optical elements, then array device quality is improved, but the number of usable optical elements decreases
Solution Approach 1:
The patent applies local quality by determining dicing lines based on the specific locations of defective optical elements detected during inspection. Rather than uniformly reducing the number of elements, the system locally adjusts the dicing pattern to exclude only those specific defective elements while preserving all non-defective elements. This ensures high array device quality while maximizing the quantity of usable optical elements.
3Loss of substance
If inspection and selective dicing are implemented, then waste of defective elements is reduced, but manufacturing time and cost increase
Solution Approach 1:
The patent applies feedback by using the inspection results to dynamically determine the dicing lines. The inspection unit provides real-time information about defective optical element locations, and this feedback is used to adjust the dicing pattern accordingly. This ensures that no non-defective elements are wasted while minimizing the addition of inspection time to the manufacturing process.
Data Source
AI summary
An array device manufacturing method includes the steps of forming a plurality of optical elements on a wafer; inspecting the plurality of optical elements; defining dicing lines on the basis of a result of the inspection such that an array device composed entirely of one or more non-defective ones of the plurality of optical elements is obtained, the one or more non-defective ones being determined to be non-defective in the inspection; and forming the array device by dicing the wafer along the dicing lines.