Optical Assembly Miniaturization via Folded Light Path

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Solution Overview

Problem

The use of Chip On Board (COB) technology in optical modules results in a long optical path, leading to increased size and difficulty in miniaturization due to the length of the molded plastic piece required.

Innovation Solution

An optical assembly with a total reflection device and a light splitting surface is integrated into the light processing portion, allowing for a shorter optical path and enabling miniaturization by using a COB packaging method, where the total reflection device reflects incident rays back to a connected fiber and a small part is directed to a monitor photodetector for testing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If COB packaging is used with a clearance surface for light reflection, then light monitoring capability is achieved, but the optical path length increases and the molded plastic piece becomes relatively long

Engineering Contradiction:
Improvelight monitoring capabilityVSAvoidmolded plastic piece length
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent combines the light reflection function and light monitoring function into a single integrated light processing portion. The light splitting surface and total reflection device are integrated within the same component structure, eliminating the need for separate clearance surfaces and reducing the overall optical path length while maintaining both monitoring capability and compact dimensions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the optical path configuration from a linear extended path to a folded path utilizing the light splitting surface and total reflection device. By introducing dimensional changes in the light path routing, the optical path is folded back within a compact space, achieving short optical path length while maintaining monitoring functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If a long optical path is used for light processing, then light monitoring is enabled, but miniaturization of the optical module becomes difficult

Engineering Contradiction:
Improvelight monitoring capabilityVSAvoidoptical module size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent merges the light reflection function and light monitoring function into a single integrated light processing portion. The light splitting surface and total reflection device are integrated within the same component structure, eliminating the need for separate clearance surfaces and reducing the overall optical path length while maintaining both monitoring capability and compact dimensions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the optical path configuration from a linear extended path to a folded path utilizing the light splitting surface and total reflection device. By introducing dimensional changes in the light path routing, the optical path is folded back within a compact space, achieving short optical path length while maintaining monitoring functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for a compact optical module design, reducing the size of the optical assembly and enabling miniaturization while maintaining efficient light processing and monitoring capabilities.

Implementation Method 1

a light splitting surface is disposed in the light processing portion and is in contact with the total reflection device, where the light splitting surface is configured to reflect a part of incident rays to a monitor photodetector MPD

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

the total reflection device is disposed in the light processing portion, configured to reflect, to the fiber connected to the fiber connection portion, the incident rays transmitted by the light splitting surface

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 3

a first lens and a second lens are further disposed in the light processing portion, where the first lens is disposed at a position from which the incident rays enter an optical path, and is configured to refract dispersed incident rays to parallel incident rays

Methodology Applied
Scientific EffectLight refraction: Refraction

Implementation Method 4

the second lens is disposed on an optical path that is obtained after reflection by the total reflection device, and is configured to focus the incident rays reflected by the total reflection device

Methodology Applied
Scientific EffectLight focusing: Lens

Data Source

PatentEP3109681B1Optical assembly and optical module
Publication Date: 2019.08.07 HUAWEI TECH CO LTD
  • EP3109681B1 patent drawingFigure 1a~1b
  • EP3109681B1 patent drawingFigure 2a~2b
  • EP3109681B1 patent drawingFigure 3~4

AI summary

Embodiments of the present invention provide an optical assembly and an optical module, where the optical assembly includes a main body and a total reflection device, where the main body includes a fiber connection portion and a light processing portion, where the fiber connection portion is connected to the light processing portion, the fiber connection portion is connected to an external fiber, and a light splitting surface is disposed in the light processing portion, configured to reflect a part of incident rays to an MPD, and transmit the other part of the incident rays; and the total reflection device is disposed in the light processing portion, configured to reflect, to the fiber connected to the fiber connection portion, the incident rays transmitted by the light splitting surface. The light splitting surface is disposed to directly reflect a part of incident rays to the MPD for testing. In this way, an optical path is relatively short, and package can be performed by means of a COB, thereby decreasing a size of the optical assembly, and implementing miniaturization of the optical module to which the optical assembly is applied.