Optical Assembly Compact Design via Dual-Functional PCB Hole
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Solution Overview
Problem
Existing optical assemblies are not compact enough due to separate components for radiation emission and optical coupling, leading to increased size and space requirements.
Innovation Solution
A dual-functional hole in the circuit board accommodates a radiation emitter and allows optical coupling between the photonic chip and a wave-guiding element, with a lens device forming a self-contained optical connector to minimize assembly size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate components are used for radiation emission and optical coupling, then functional reliability is improved, but assembly size increases
Solution Approach 1:
The patent merges the radiation emitter and optical coupling functions into a single integrated component. The radiation emitter is mounted directly on the photonic chip such that its radiation emission surface is in direct optical coupling with the wave-guiding element, eliminating the need for separate optical coupling components and reducing overall assembly size while maintaining functional reliability
Solution Approach 2:
The mounted component serves multiple functions simultaneously: it acts as both a radiation emitter and an optical coupling element. The component's radiation emission surface directly interfaces with the wave-guiding element, allowing it to perform both radiative and optical coupling functions in a single integrated structure
2Volume of moving object
If a compact design is implemented, then space requirements are reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the optical assembly into distinct functional modules: the photonic chip with integrated wave-guiding elements, the mounted component with radiation emission surface, and the lens device. This segmentation allows each module to be optimized and manufactured separately before final assembly, reducing overall manufacturing complexity while achieving compact integration
Solution Approach 2:
The patent employs a nested arrangement where the radiation emitter is mounted on the photonic chip and positioned within the optical path of the wave-guiding element. The lens device is subsequently positioned to optimize optical coupling, creating a nested structure that minimizes space requirements while maintaining manufacturability through systematic assembly
3Volume of moving object
If optical coupling and heat management are integrated, then assembly compactness is improved, but thermal management challenges increase
Solution Approach 1:
The patent introduces thermal via holes as intermediary structures that conduct heat away from the photonic chip and mounted component. These thermal via holes act as thermal pathways that manage the heat generated by the compact integrated components, enabling effective thermal management despite the reduced spacing between optical elements
Solution Approach 2:
The patent addresses thermal management by extending heat dissipation into the vertical dimension through thermal via holes that penetrate the circuit board. This three-dimensional thermal pathways allow heat to be conducted away from the compact horizontal assembly, effectively managing thermal density without increasing lateral footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compact design reduces space requirements by integrating optical coupling and heat management within the assembly, allowing for efficient radiation transmission and heat dissipation.
Implementation Method 1
a lens device (500) that is configured to transmit radiation between the wave-guiding element (400) and the photonic chip (200)
Implementation Method 2
The facet is preferably capable of reflecting radiation that originates from the photonic chip and passes the lid and a waveguide's cladding, into a waveguide's core and/or reflecting radiation that propagates through the waveguide's core towards the facet, from the waveguide's core into the waveguide's cladding towards the lid and the photonic chip
Implementation Method 3
an optical waveguide, and a lid covering the optical waveguide
Data Source
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AI summary
An embodiment of the invention relates to an optical assembly comprising a circuit board comprising a first side, a second side, and at least one hole that extends through the circuit board, a photonic chip having a front side and a back side, the front side of the photonic chip being mounted on the first side of the circuit board and electrically connected to at least one electrical conductor of the circuit board, at least one component being mounted on the front side of the photonic chip opposite the hole and protruding from the front side of the photonic chip into the hole or through the hole, and a wave-guiding element that is located on the second side of the circuit board and optically coupled to the photonic chip through said hole.