Optical Attenuating Element for Semiconductor Light Coupling
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Solution Overview
Problem
Existing arrangements with light-emitting semiconductor components face challenges in producing white light efficiently and cost-effectively, particularly in achieving precise separation between light and dark areas due to optical coupling issues between adjacent components with converter encapsulations.
Innovation Solution
An arrangement with at least two light-emitting semiconductor components, each partially or fully surrounded by encapsulations containing a converter substance, incorporates an optical attenuating element between the components to reduce optical coupling, which is implemented using a light-transmissive cover with a silicon strip or injection-molded plastic to optically isolate the encapsulations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple light-emitting semiconductor components with converter encapsulations are arranged adjacent to each other, then white light can be generated efficiently, but optical coupling between adjacent components causes imprecise separation between light and dark areas
Solution Approach 1:
The patent divides the optical path between adjacent semiconductor components by introducing optical attenuating elements (such as opaque partitions or absorptive materials) that segment the radiation field. This allows each component's light output to be independently controlled while preventing cross-illumination, thereby achieving precise light-dark area separation while maintaining efficient white light generation from multiple adjacent components.
Solution Approach 2:
The patent introduces optical attenuating elements as intermediary components positioned between adjacent light-emitting semiconductor components. These intermediaries absorb or block stray radiation, preventing it from exciting converter substances in neighboring components. This mediator approach enables precise optical isolation while maintaining the compact adjacent arrangement necessary for efficient white light generation.
2Manufacturing precision
If optical attenuating elements are introduced between adjacent semiconductor components, then optical coupling is reduced and light-dark area separation is improved, but device complexity increases
Solution Approach 1:
The patent combines the optical attenuating elements with existing structural components of the device, such as integrating opaque partitions into the housing or mounting structure. By merging the light-blocking function with already-present structural elements, the patent achieves effective optical isolation without adding separate, complex components, thereby minimizing the increase in device complexity while maintaining precise light-dark area separation.
Solution Approach 2:
The patent designs optical attenuating elements that serve multiple functions: they block stray radiation to prevent cross-illumination, provide structural support for component mounting, and potentially serve as thermal management pathways. This multi-functionality reduces the need for additional dedicated components, thereby achieving precise optical separation while limiting the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the simple and cost-effective production of white light by reducing optical coupling between semiconductor components, enabling precise separation of light and dark areas with a high contrast ratio, such as 200:1, and maintaining a homogeneously appearing luminous image.
Implementation Method 1
the converter substance converts the radiation emitted by the semiconductor component in a first wavelength range (primary radiation) into radiation in a second wavelength range (secondary radiation)
Implementation Method 2
The attenuating element optically insulates the respective encapsulations in order to reduce optical coupling of radiation emitted by at least one of the semiconductor components into the encapsulation of at least one of the other semiconductor components
Data Source
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Figure 7~9D
AI summary
An arrangement having at least two light-emitting semi-conductor components (101, 111) that are disposed adjacent to each other comprises jackets (102, 112), which each at least partially surround the at least two light-emitting semi-conductor components. In the jackets a converter substance is present, which partially or completely converts the wavelength range of the radiation emitted by the semi-conductor components. Between the at least two light-emitting semi-conductor components, at least one optical damping element (103) is disposed, which optically insulates the respective jackets of the semi-conductor components in order to reduce any coupling of at least one jacket (102) into at least one other jacket (112), or in order to reduce the coupling of at least one semi-conductor component (101) into the jacket (112) of at least one of the other semi-conductor components (111).