Optical Backplane Interposer for Multi-Chip Photonic Quantum Assembly
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Solution Overview
Problem
Existing quantum computing and quantum communication systems face challenges in integrating passive and active photonic integrated circuits with other optical and electrical components to reliably generate, manipulate, and detect hundreds, thousands, or even millions of qubits for computing and error corrections.
Innovation Solution
A quantum photonic device is proposed, featuring an optical backplane with optical waveguide layers and multiple die stacks, each comprising a photonic integrated circuit (PIC) and an electronic integrated circuit (EIC) bonded together. The optical waveguide layers are configured to transport photonic quantum systems between die stacks, enabling the manipulation and detection of quantum states.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple photonic integrated circuits and optical components are integrated into the same system, then the quantum state generation and manipulation capability is improved, but the device complexity increases
Solution Approach 1:
The system is divided into multiple die stacks, where each die stack contains a photonic integrated circuit die and an electronic integrated circuit die. This segmentation allows independent fabrication and testing of individual die stacks before final assembly, reducing overall system integration complexity while maintaining the capability to generate and manipulate multiple qubits.
Solution Approach 2:
An optical backplane with optical waveguide layers is introduced as an intermediary component to interconnect multiple die stacks. The waveguides transport photonic quantum states between die stacks, enabling complex quantum operations without requiring direct integration of all components, thus managing system complexity while achieving reliable quantum state manipulation.
2Productivity
If hundreds or thousands of qubits are integrated for computing and error corrections, then the quantum computing performance is improved, but the manufacturing precision requirements increase
Solution Approach 1:
By segmenting the large-scale quantum system into multiple die stacks, each containing a manageable number of qubits and associated components, the manufacturing precision requirement for each individual die stack is reduced. Standardized die stack designs enable repeated fabrication processes with controlled precision requirements.
Solution Approach 2:
The optical backplane with standardized waveguide interfaces serves as a universal platform that can accommodate multiple types of die stacks. This universality allows for modular assembly where precision requirements are concentrated at the standardized interface level rather than requiring high precision throughout the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient generation, manipulation, and detection of quantum states, enhancing the performance and reliability of quantum computing and communication systems by integrating multiple qubits and components within a single system.
Implementation Method 1
an optical backplane that includes at least one optical waveguide layer... waveguides optically coupled to at least two die stacks... configured to transport, between the at least two die stacks, a photonic quantum system that includes a photon in one of two or more quantum modes
Implementation Method 2
the photonic integrated circuit may include a single photon source configured to generate the photon
Implementation Method 3
the PIC die may include a grating coupler configured to couple light from the optical fiber to at least one of a data communication photodetector or a single photon generator in the PIC die
Data Source
AI summary
A system includes a plurality of wafer-scale modules and a plurality of optical fibers. Each wafer-scale module includes an optical backplane and one or more die stacks on the optical backplane. The optical backplane includes a substrate and at least one optical waveguide layer configured to transport and/or manipulate photonic quantum systems (e.g., photons, qubits, qudits, large entangled states, etc.). Each die stack of the one or more die stacks includes a photonic integrated circuit (PIC) die optically coupled to the at least one optical waveguide layer of the optical backplane. The plurality of optical fibers is coupled to the optical backplanes of the plurality of wafer-scale modules to provide inter-module and/or intra-module interconnects for the photonic quantum systems.