Optical Component Backside Assembly for Dense Low-Noise Sensing
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Solution Overview
Problem
The challenge in the electronics industry is to efficiently integrate a large number of electronic components on a substrate while managing the size of these components to optimize space and reduce noise interference in optical devices.
Innovation Solution
The optical device design includes an optical component with a sensing surface and a backside surface, where an electrical component is positioned adjacent to the backside surface to support the optical component, with a portion of the backside surface exposed, and a method for manufacturing involves singulating optical structures with electrical components disposed on the backside surfaces to form optical devices, allowing for efficient assembly and reduced noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the size of electronic components is reduced to dispose more components on the substrate, then the quantity of components increases, but the noise interference increases and sensing accuracy deteriorates
Solution Approach 1:
The patent divides the optical component and electrical component into separate singulated structures rather than integrating them into a single large component. This segmentation allows each component to be optimized independently - the optical component maintains its sensing performance while the electrical component provides necessary support functions, thereby reducing noise interference while maintaining component density
Solution Approach 2:
The patent transitions from a planar 2D arrangement to a 3D stacked configuration where the optical component and electrical component are vertically arranged. This dimensional change allows components to be disposed closer together in the vertical direction, increasing the effective component density without increasing the horizontal footprint, thereby reducing noise interference while maintaining quantity
2Area of stationary object
If the size of electronic components is reduced to optimize space, then the area occupied decreases, but the manufacturing complexity increases
Solution Approach 1:
The patent merges the optical component and electrical component into a single integrated optical device structure that is singulated together as one unit. This combining approach simplifies manufacturing by eliminating the need for separate assembly steps, reducing handling complexity, and enabling the device to be disposed as a compact integrated unit with reduced area footprint
Solution Approach 2:
The patent performs preliminary actions by disposing electrical components on the backside surfaces of optical structures before the final singulation process. This preliminary arrangement allows for optimized component placement and electrical connections to be established in advance, simplifying the subsequent manufacturing steps and reducing overall manufacturing complexity while achieving compact area occupation
Data Source
AI summary
An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.