Optical Communication Bar With Embedded Waveguides for Die Interconnects

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Solution Overview

Problem

Existing electronic assemblies face challenges in efficiently providing high-bandwidth, low-latency optical interconnects across various components due to limitations in current optical communication technologies, particularly in long-haul and transoceanic communications.

Innovation Solution

Incorporation of optical communication bars with photonic waveguides and optical engines, including converters and controller logic, to facilitate modular and flexible optical paths between dies or packages, supporting both short and long-range connections using various fabrication techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If optical communication bars with photonic waveguides are used to provide optical interconnect paths between dies, then bandwidth and latency performance is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

ImprovebandwidthVSAvoiddevice complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent embeds optical communication bars within packaging substrates and integrates photonic waveguides into existing electronic assembly layers. The optical engines are nested within the packaging substrate structure, allowing optical interconnects to coexist with electrical interconnects in a hierarchical integration manner that manages complexity while enabling high bandwidth communication between dies.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent introduces optical engines as intermediary components that convert electrical signals to optical signals and back. These optical engines are integrated into the packaging substrate and serve as mediators between electrical circuitry and photonic waveguides, enabling seamless integration of optical communication capabilities into existing electronic assemblies without requiring complete system redesign.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If optical communication bars are integrated within or underneath routing layers in 3D configuration, then interconnect density and bandwidth are improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveinterconnect densityVSAvoidmanufacturing precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent forms photonic waveguides and optical paths within the packaging substrate before mounting dies and optical engines. By pre-establishing the optical infrastructure in the substrate, the system enables subsequent integration steps to proceed with standard precision requirements, avoiding the need for high-precision alignment during final assembly while achieving high interconnect density through 3D configuration.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If optical engines are hybrid bonded in stacked assemblies, then integration flexibility and adaptability are improved, but manufacturing complexity increases

Engineering Contradiction:

Improveintegration flexibilityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent divides the optical communication system into separate modular components: optical engines, photonic waveguides, controllers, and transceivers. Each component can be independently fabricated, tested, and optimized using standard semiconductor manufacturing processes. The hybrid bonding technology enables these segmented components to be assembled into stacked configurations, providing integration flexibility while maintaining manufacturing simplicity through modular assembly rather than monolithic fabrication.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables reduced energy consumption and latency in optical interconnects, particularly for high-bandwidth applications, while allowing for cost-effective and adaptable integration with electronic assemblies.

Implementation Method 1

The optical communication bar can include photonic waveguides formed using a variety of suitable techniques

Methodology Applied

Scientific EffectOptical waveguide transmission: Waveguide (optics)

Implementation Method 2

a first optical engine including a first controller logic and first optical transmitter, a second optical engine including a second controller logic and second optical detector

Methodology Applied

Scientific EffectElectrical-to-optical conversion:

Implementation Method 3

a first internal optical-to-electrical (OE) converter coupled with the local waveguide, a first internal electrical-to-optical (EO) converter coupled with the local waveguide

Methodology Applied

Scientific EffectOptical-to-electrical conversion:

Data Source

PatentUS20260019165A1Optical Communication Bar

Publication Date: 2026.01.15 APPLE INC

AI summary

Electronic assemblies and systems are described in which optical communication bars are incorporated to provide optical interconnect paths between various components, local or remote. The optical communication bars can include photonic waveguides formed using a variety of suitable techniques and may include photonic wires (e.g., bundled fiber or formed using 3D multi-photon write, holographic write, micro-pen write, direct optical wire bonding, or a mix), or index defined patterns forms using techniques such as nano imprint (embossing), lithography, etc.