Optical Barrier Integrated in Package Material for Proximity Sensors
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Solution Overview
Problem
Conventional methods for packaging proximity sensors with optical barriers, such as metal frames, plastic caps, and spacers, increase process complexity and difficulty in achieving high isolation efficiency and minimizing package size, leading to reduced product yield and increased manufacturing time.
Innovation Solution
The optical barrier is integrated within the package material, allowing direct contact between the emitter and the barrier, which is then sealed within the package, eliminating the need for additional processes like cap formation and spacer placement, thereby simplifying the manufacturing process and achieving efficient packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal frames or plastic caps are used as barrier structures, then optical isolation between emitter and detector is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the optical barrier function with the package material itself, eliminating the need for separate metal frames or plastic caps. The package material is designed to inherently provide optical isolation while enclosing the emitter and detector, thus merging two previously separate functions into one integrated solution.
Solution Approach 2:
The package material serves multiple functions simultaneously: it provides mechanical protection, environmental sealing, and optical isolation. By making the package material itself the barrier structure, it becomes a multi-functional component that eliminates the need for dedicated barrier structures.
2Object-affected harmful factors
If spacers are placed on the cutting path to isolate emitter and detector, then optical isolation is improved, but manufacturing time and process complexity increase
Solution Approach 1:
The patent eliminates the need for separate spacer components by integrating the optical isolation function directly into the package material structure. The package material is molded or formed to create built-in isolation features, removing the additional step of placing and securing spacers.
Solution Approach 2:
The optical isolation structure is pre-formed as part of the package material before the emitter and detector are assembled. The package material is prepared in advance with integrated barrier features that automatically provide optical isolation when the components are enclosed, eliminating post-assembly spacer installation.
3Object-affected harmful factors
If high accuracy alignment is required between barrier elements and packaged structure, then optical isolation effectiveness is improved, but manufacturing precision requirements and difficulty increase
Solution Approach 1:
The patent merges the barrier function with the package material, eliminating the need for separate alignment between discrete barrier elements and the packaged structure. Since the package material itself forms the barrier, alignment issues are resolved by the inherent integration of the isolation features within the material structure.
Solution Approach 2:
The patent changes the physical state or form of the barrier from discrete components requiring precise alignment to an integrated feature of the package material. This parameter change from separate parts to integrated structure fundamentally reduces or eliminates alignment precision requirements.
4Object-affected harmful factors
If additional processes like cap formation and spacer placement are performed, then optical isolation is improved, but productivity decreases
Solution Approach 1:
The patent combines multiple manufacturing operations into a single integrated process. The package material is formed or molded to include built-in optical isolation features, allowing the packaging process to accomplish both enclosure and optical isolation in one operation, thereby eliminating additional steps for cap formation and spacer placement.
Solution Approach 2:
The package material is designed as a multi-functional component that simultaneously provides mechanical protection, environmental sealing, and optical isolation. This universality allows a single material and process to achieve multiple objectives that previously required separate components and processes, thereby improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively isolates optical interference between the emitter and detector, reduces the size of the package structure, and enhances manufacturing efficiency by eliminating unnecessary steps, resulting in a more compact and reliable proximity sensor design.
Implementation Method 1
an optical barrier 130 disposed between the emitter 110 and the detector 120 for shielding the excess optical signal 111
Data Source
AI summary
A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.