Multi-Chip System Optical Baseplate Electrical Proximity Bridge
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Solution Overview
Problem
As microprocessor performance increases, latency issues in global on-chip wires and high power consumption become significant constraints, limiting further clock frequency improvements and requiring new communication methods to meet high-bandwidth requirements in multi-core processors.
Innovation Solution
A multi-chip system utilizing a baseplate for optical communication between chip modules, combined with electrical proximity communication, where bridge components facilitate data transfer between chip modules via optical and electrical paths, enabling high-bandwidth inter-chip communication with low latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrical proximity communication is used for high-bandwidth communication between chip modules, then communication bandwidth is improved, but signal latency increases due to the physical distance and medium limitations
Solution Approach 1:
The patent introduces an optical intermediary (light signal) to transfer data between chip modules. The optical signal serves as a mediator that carries information across the physical gap between electrical domains, enabling high bandwidth while maintaining low latency because light travels faster than electrical signals through the medium.
Solution Approach 2:
The patent replaces the traditional electrical signal transmission mechanism with an optical transmission mechanism. By substituting electrical fields with optical fields (light), the system achieves faster signal propagation speed and higher bandwidth capability while reducing the latency associated with electrical signal traversal through conductive media.
2Loss of time
If multiple processor cores are used to reduce global delays, then communication latency is improved, but power consumption increases significantly
Solution Approach 1:
The patent segments the communication function into two distinct parts: electrical proximity communication for short-range, high-bandwidth data transfer between adjacent chip modules, and optical communication for longer-range signal transmission. This segmentation allows each component to operate at optimal power levels for its specific function, reducing overall system power consumption compared to using multiple active processor cores for all communication tasks.
Solution Approach 2:
The optical signal acts as an intermediary that enables communication between chip modules without requiring continuous activation of multiple processor cores. By using light as the communication medium, the system can maintain low power consumption in idle states while achieving fast communication when needed, avoiding the constant power draw of multiple active cores.
3Speed
If clock frequency is increased to improve microprocessor performance, then processing speed is improved, but latency in global on-chip wires increases
Solution Approach 1:
The patent substitutes electrical signal transmission through on-chip wires with optical signal transmission for inter-chip module communication. Light signals travel faster and are less susceptible to the latency problems that plague electrical signals in global on-chip wires, especially at high clock frequencies. This substitution enables the system to maintain high processing speeds without suffering from increasing wire latency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for high-bandwidth, low-latency communication between chip modules, effectively addressing latency and power consumption issues, enabling the creation of high-performance multi-core processor systems.
Implementation Method 1
the baseplate is configured to communicate data signals via optical communication
Implementation Method 2
electrical proximity communication, where bridge components facilitate data transfer between chip modules via optical and electrical paths
Data Source
AI summary
Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.