Optical Bidirectional Module Substrate Integration
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Solution Overview
Problem
Existing optical bidirectional communication modules face challenges in downsizing while maintaining low production costs, as individual packaging of semiconductor laser and photodiode components leads to increased size and higher production costs due to decreased fabrication yield.
Innovation Solution
An optical bidirectional communication module integrates a light-emitting element, a light-receiving element, and an optical waveguide on a substrate, with the waveguide performing wavelength division and guiding light, and using alignment marks for precise mounting, thereby enabling downsizing without increasing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual packaging of semiconductor laser and photodiode is used, then reliability is improved, but device size increases and production cost increases
Solution Approach 1:
The patent merges the semiconductor laser and photodiode into a single integrated optical module on one substrate, eliminating the need for separate packaging while maintaining functional reliability through integrated design and optical coupling
2Volume of moving object
If bandpass filter is adhesively mounted to groove by dicing process, then device size is reduced, but fabrication yield decreases and production cost increases
Solution Approach 1:
The patent combines the bandpass filter with the substrate to form an integrated structure, eliminating the need for separate adhesive mounting and dicing processes that reduce yield, while achieving further miniaturization through integration
Solution Approach 2:
The bandpass filter is integrated into the substrate design from the outset rather than being added as a separate component through post-fabrication processes, preventing yield loss associated with adhesive mounting and dicing operations
3Volume of moving object
If bandpass filter is adhesively mounted to groove by dicing process, then device size is reduced, but production cost increases
Solution Approach 1:
The patent merges the bandpass filter into the substrate structure, eliminating the need for adhesive mounting and dicing processes that increase production costs, while achieving miniaturization through integrated design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of components on a substrate allows for a compact optical bidirectional communication module with reduced production costs and improved fabrication yield, facilitating efficient optical communication.
Implementation Method 1
The optical waveguide performs wavelength division on light received from an optical fiber and guides the received light to the light-receiving element
Implementation Method 2
The optical waveguide performs wavelength division on light received from an optical fiber and guides the received light to the light-receiving element
Implementation Method 3
The optical waveguide also performs wavelength division on light emitted from the light-emitting element and guides the emitted light to the optical fiber
Implementation Method 4
The optical waveguide also performs wavelength division on light emitted from the light-emitting element and guides the emitted light to the optical fiber
Data Source
AI summary
An optical bidirectional communication module includes a light-emitting element, a light-receiving element and an optical waveguide. The optical waveguide performs wavelength division on light received from an optical fiber and guides the received light to the light-receiving element. The optical waveguide also performs wavelength division on light emitted from the light-emitting element and guides the emitted light to the optical fiber. The light-emitting element, the light-receiving element and the optical waveguide are incorporated on an optical substrate.