Optical Circuit Board Alignment Marks for Precise Component Mounting

The patent applies preliminary action by pre-forming the optical waveguide structure with cores and cladding layers before the dicing process. The waveguide is constructed with precise layering of lower cladding layer, cores, and upper cladding layer, establishing the optical paths and alignment references beforehand. This ensures that subsequent dicing operations do not compromise the already-established positional accuracy of the cores, thereby maintaining both manufacturing efficiency and precision.

The patent uses alignment marks as reference copies that replicate the positional information of the cores. These alignment marks are formed simultaneously with the cores through the same layering process, creating identical positional patterns on the lower cladding layer. During mounting, optical components are aligned to these marks rather than directly to the cores, eliminating positioning errors that would otherwise occur during dicing while maintaining manufacturing efficiency.

The patent merges the formation of alignment marks with the formation of cores by applying alignment mark members simultaneously with the core materials during the layering process. Both the optical waveguide structure and the alignment reference marks are created in the same manufacturing sequence, eliminating the need for separate alignment mark fabrication steps. This integration reduces overall device complexity while achieving high mounting precision.

The lower cladding layer serves multiple functions: it provides the structural base for the optical waveguide, supports the cores, and simultaneously carries the alignment marks. By making the lower cladding layer multi-functional, the patent avoids adding separate components for alignment, thereby improving mounting precision without significantly increasing device complexity.