Optical Bond Head Parallelism Measurement for Thermocompression Bonding
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Solution Overview
Problem
Existing electronic component bonding machines face challenges in achieving precise parallelism between the bonding tool and the support structure, which affects the quality and consistency of solder bond heights, particularly in thermocompression bonding processes.
Innovation Solution
An electronic component bonding machine equipped with a non-contact optical measuring system that uses an optical source and sensor to determine and adjust the parallelism between the bond head assembly and the support structure, allowing for accurate alignment and control of solder bond heights through optical distance measurements and profile analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional contact-based measurement methods are used to measure parallelism, then measurement can be performed, but the sensitive surfaces may be damaged and thermal interference occurs
Solution Approach 1:
The patent replaces traditional mechanical contact-based measurement systems with an optical measurement system. The optical sensor and light source measure parallelism by detecting reflected light from the bonding tool and substrate surfaces, eliminating mechanical contact that causes surface damage and thermal interference while maintaining measurement precision through optical field interactions.
2Productivity
If manual measurement and adjustment methods are used, then the system is simpler, but measurement time increases and throughput decreases
Solution Approach 1:
The patent implements a self-service measurement and adjustment system where the optical measurement system automatically captures images of the bonding tool and substrate, the computer automatically processes the images to calculate parallelism, and the system automatically adjusts the bonding tool position based on the calculated deviations, eliminating manual intervention and significantly reducing measurement time to maintain high bonding throughput.
Solution Approach 2:
The patent establishes a closed-loop feedback system where the optical sensor continuously measures the actual position and orientation of the bonding tool relative to the substrate, the computer processes this data to determine parallelism deviations, and the system uses this feedback information to automatically adjust the bonding tool positioning, enabling real-time correction and maintaining high productivity through automated control.
3Manufacturing precision
If precise parallelism control is implemented, then bonding quality improves, but system complexity increases
Solution Approach 1:
The patent introduces an optical field as an intermediary between the measurement system and the bonding surfaces. The light source and optical sensor create and detect optical fields that interact with the bonding tool and substrate surfaces to extract position and orientation information, serving as a non-intrusive mediator that enables precise parallelism measurement without mechanical contact or thermal interference.
Solution Approach 2:
The patent replaces complex mechanical measurement devices with an optical measurement system consisting of light sources, optical sensors, and image processing algorithms. This substitution achieves precise parallelism control through optical field interactions and computational analysis, reducing mechanical complexity while maintaining or improving measurement accuracy for solder bond height consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables precise control of parallelism, ensuring high-quality bonding operations with reduced measurement time and increased throughput, while protecting sensitive surfaces from damage and thermal interference.
Implementation Method 1
an optical source for providing an optical signal directed toward at least one of the upper target and the lower target, an optical sensor for receiving a reflected optical signal from at least one of the lower target and the upper target
Data Source
AI summary
An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.