Optical Member Bonding Layout for Light-Resistant Laser Packages
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Solution Overview
Problem
Existing light-emitting devices face challenges in maintaining stable adhesion of optical members due to degradation of adhesives under light exposure, leading to potential quality degradation and reduced device performance over time.
Innovation Solution
A light-emitting device design utilizing two types of adhesives, where a UV-curable resin (first adhesive) is used for initial bonding and positioning, and a thermosetting resin (second adhesive) with better light resistance is used for long-term stability, ensuring the optical member remains fixed even as the first adhesive degrades.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a UV-curable resin (first adhesive) is used for initial bonding and positioning, then positioning precision and initial adhesion are improved, but light resistance and long-term adhesion stability deteriorate
Solution Approach 1:
The bonding function is segmented into two distinct adhesive layers: a first adhesive (UV-curable resin) for initial positioning and bonding, and a second adhesive (thermosetting resin) for long-term light resistance. This segmentation allows each adhesive to specialize in one function, resolving the contradiction between positioning precision and light resistance.
Solution Approach 2:
The patent uses a composite adhesive structure with two different resin materials having complementary properties. The UV-curable resin provides rapid curing and precise positioning, while the thermosetting resin provides superior light resistance and long-term stability. This composite approach combines the advantages of both materials to resolve the technical contradiction.
2Reliability
If a single adhesive with good light resistance is used, then long-term adhesion stability is improved, but positioning precision and initial bonding speed deteriorate
Solution Approach 1:
The bonding process is divided into two stages with different adhesive materials: initial bonding using UV-curable resin for precision, and long-term stabilization using thermosetting resin for light resistance. This segmentation resolves the contradiction between positioning precision and adhesion stability.
Solution Approach 2:
The first adhesive (UV-curable resin) performs the preliminary action of precise positioning and initial bonding before the second adhesive takes over for long-term stability. This preliminary action ensures positioning precision is achieved first, then maintained over time.
3Strength
If the adhesive is placed closer to the emission surface of the optical member, then bonding strength is improved, but light exposure and degradation increase
Solution Approach 1:
The patent applies a composite adhesive system where the second adhesive (thermosetting resin) with superior light resistance is positioned to provide both bonding strength and protection against light exposure. The combination of materials allows the adhesive layer to maintain strength while resisting degradation from light.
Solution Approach 2:
The patent changes the chemical composition parameters of the adhesive by using two different resin types with different photostability characteristics. This parameter change allows the adhesive system to maintain bonding strength while reducing sensitivity to light exposure through the inherent light resistance of the thermosetting resin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures stable adhesion and performance of the light-emitting device over a longer period, as the second adhesive maintains bonding strength even after the first adhesive is charred by light exposure, preventing quality degradation and extending device lifespan.
Implementation Method 1
an adhesive of a UV-curable resin
Implementation Method 2
a thermosetting resin (second adhesive) with better light resistance
Data Source
AI summary
A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.