Optically Bridged Multi-Die Package for Low-Latency AI Interconnects
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Solution Overview
Problem
Existing electrical interconnects in semiconductor dies consume high power, have pin count limitations, and inefficiently transport data to the edge of the chip, making it difficult for AI computing hardware to meet the demands of AI applications.
Innovation Solution
Implementing optical multi-die interconnect bridges (OMIBs) with temperature-stabilized modulators that bridge semiconductor dies, allowing photonic data transport directly to the central region of the die, reducing power consumption and latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If electrical interconnects are used to transport data in semiconductor dies, then data can be transmitted between components, but power consumption is high and latency is increased
Solution Approach 1:
The patent replaces electrical signal transmission through copper interconnects with optical signal transmission through photonic interconnects. Light signals travel faster and consume less power than electrical signals in traditional metal interconnects, directly addressing the contradiction between power consumption and latency by substituting the transmission medium from electrical to optical domain
Solution Approach 2:
The patent changes the fundamental parameter of signal transmission from electrical to optical. By using photons instead of electrons for data transmission, the system achieves lower power consumption and reduced latency, as optical signals experience less resistance and heating effects compared to electrical signals in metal interconnects
2Productivity
If electrical interconnects route data to the edge of the chip, then data can be transmitted, but the transport efficiency is reduced
Solution Approach 1:
The patent introduces photonic interconnects that operate in a different dimension (optical domain) compared to traditional electrical interconnects. This allows light signals to traverse the chip substrate directly without being constrained by the same physical routing limitations, enabling more efficient data transport paths and reducing the need to route data to chip edges
3Adaptability or versatility
If optical modulators operate over extended temperature ranges, then the device becomes more versatile, but temperature-dependent performance variations occur
Solution Approach 1:
The patent implements a feedback mechanism where a temperature sensor continuously monitors the modulator's temperature and feeds this information to a controller. The controller adjusts the bias voltage applied to the modulator based on the detected temperature, compensating for temperature-dependent performance variations and maintaining stable operation across extended temperature ranges
Solution Approach 2:
The patent dynamically changes the bias voltage parameter applied to the optical modulator based on temperature conditions. By adjusting this electrical parameter in response to temperature variations, the system compensates for thermal effects on optical performance, enabling reliable operation over extended temperature ranges while maintaining performance stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
OMIBs provide faster and more efficient data transfer by carrying data photonically to the point of compute, reducing electrical power consumption and latency, enabling feasible complex AI systems.
Implementation Method 1
a modulator (MOD 1721, 1741, 1761, 1781) with a first modulator input
Implementation Method 2
a photodetector (PD 1722, 1742, 1762, 1782) with a second photodetector output
Data Source
AI summary
A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.