Optical Bridge Semiconductor Package for High-Speed Die Communication
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Solution Overview
Problem
The challenge in the semiconductor industry is to provide high-speed, reliable communication between integrated circuits while maintaining miniaturization and integrating multiple components in a small package, particularly when combined with Wafer Level Packaging (WLP) technology.
Innovation Solution
The integration of optical bridges between integrated circuit dies using fiber optical communication, where electrical signals are converted to optical signals for faster communication and then converted back to electrical signals, facilitated by optical bridges mounted on redistribution structures or interposers, enhancing communication speed and reducing noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If fiber optical communication is used to increase communication speed between integrated circuit dies, then communication speed is improved, but device complexity increases due to the need for optical bridges and signal conversion components
Solution Approach 1:
The optical bridge die is integrated within the package structure, nesting the optical communication infrastructure within the existing semiconductor package. The optical bridge die includes waveguides and optical components that are embedded in the package substrate, allowing optical communication to occur within the compact package without requiring external optical components.
Solution Approach 2:
The optical bridge die acts as an intermediary component between integrated circuit dies, providing signal conversion between electrical and optical domains. The electrical-to-optical converter and optical-to-electrical converter on the optical bridge die enable communication between dies by converting electrical signals to optical signals for transmission and back to electrical signals for reception.
2Volume of moving object
If multiple integrated circuit dies are integrated in a small package to maintain miniaturization, then package size is reduced, but communication reliability deteriorates due to increased noise and signal degradation
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission for communication between integrated circuit dies. By using optical waves instead of electrical signals, the system achieves higher bandwidth and lower noise interference, improving communication reliability while maintaining compact packaging. The optical waveguides provide isolated transmission paths that are immune to electromagnetic interference.
Solution Approach 2:
The optical bridge die is positioned at a different spatial level within the package, utilizing the vertical dimension for optical signal routing. The waveguides are embedded in the package substrate and route optical signals between dies through the thickness of the package, enabling three-dimensional integration and improving signal integrity by separating optical and electrical signal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases communication speed and reduces noise, enabling efficient communication between integrated circuit dies while maintaining package miniaturization and integration density.
Implementation Method 1
electrical signals are converted to optical signals for faster communication and then converted back to electrical signals
Implementation Method 2
electrical signals are converted to optical signals for faster communication and then converted back to electrical signals
Implementation Method 3
an optical bridge die (70) that receives the optical signal and transmits the optical signal from a first end of the optical bridge die to a second end of the optical bridge die
Data Source
AI summary
A semiconductor package includes a redistribution structure, first and second integrated circuit dies that are connected to a first side of the redistribution structure, and third and fourth integrated circuit dies that are connected on a second side, opposite to the first side, of the redistribution structure. An optical bridge die is connected between the third and fourth integrated circuit dies, to the second side of the redistribution structure, which is configured such that the first and second integrated circuit dies optically communicate through the optical bridge die.