Optical Bridge Semiconductor Package for Integrated Signal Routing
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical components effectively for efficient signal conversion and communication within semiconductor packages, limiting their performance and efficiency.
Innovation Solution
The development of an optical bridge module comprising photonic components and waveguides, integrated with electronic dies and interconnect structures, enables package-level optical communication and electrical routing, facilitating both optical-electrical conversion and communication within semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical components are integrated in semiconductor packages, then signal transmission efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates optical components (waveguides, photodetectors, lasers) and electrical components (conductive interconnects, electronic devices) into a unified semiconductor package structure. The interconnect structure serves dual purposes by providing both electrical routing and optical waveguide pathways, merging previously separate systems into a single integrated architecture that improves signal transmission efficiency while managing complexity through consolidation.
Solution Approach 2:
The interconnect structure is designed to perform multiple functions simultaneously: it provides electrical connections through conductive features, guides optical signals through waveguides, and enables both electrical and optical signal transmission between package modules. This multi-functional design allows a single structure to replace what would traditionally require separate components, improving efficiency while the modular approach helps manage the inherent complexity.
2Volume of moving object
If package size is reduced, then integration density is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent embeds waveguides within the interconnect structure, placing optical components inside or alongside electrical interconnect layers. The waveguides are integrated into the existing interconnect architecture rather than adding separate optical layers, creating a nested configuration where optical and electrical pathways coexist within the same structural framework. This nesting approach reduces overall package size while utilizing the same manufacturing processes for both optical and electrical features.
Solution Approach 2:
The patent utilizes vertical stacking and three-dimensional integration to accommodate both optical and electrical components within a compact footprint. Waveguides are positioned in different layers and orientations relative to conductive interconnects, enabling efficient use of vertical space. This multi-dimensional arrangement allows high integration density without requiring proportionally increased manufacturing precision, as the design leverages established multi-layer semiconductor fabrication capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration enhances signal transmission efficiency by allowing both electrical and optical signals to be utilized effectively for short- and long-range communication, improving performance and reducing package size.
Implementation Method 1
The waveguides are optically coupled to the optical bridge modules and provide optical communication between the optical bridge modules
Implementation Method 2
devices integrating long-range optical components and short-range electrical components are formed for the conversion between optical signals and electrical signals
Data Source
AI summary
A package includes a first interconnect structure that includes conductive features and first waveguides; package modules attached to the first interconnect structure; and optical bridge modules attached to the first interconnect structure, wherein the optical bridge modules are optically coupled to the first waveguides, wherein the optical bridge modules are electrically connected to the corresponding package modules through the first interconnect structure.