Optically Bridged Multi-Die Package With Temperature-Stabilized Modulators
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Solution Overview
Problem
Existing electrical interconnects in semiconductor dies for AI and machine learning applications face high power consumption, pin count limitations, and inefficiency in data transfer, especially when memory is centralized, leading to increased latency and power usage.
Innovation Solution
Implementing optical multi-die interconnect bridges (OMIBs) with temperature-stabilized modulators that bridge semiconductor dies, allowing photonic data transfer directly to the central compute region, reducing electrical pipeline stages and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If electrical interconnects are used to connect semiconductor dies, then data transfer can be achieved, but power consumption increases and pin count limitations occur
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using photonic integrated circuits. Light signals carry data between semiconductor dies, eliminating the need for electrical signals to travel through physical wires and pins. This substitution reduces power consumption significantly while increasing data transfer bandwidth and efficiency, as optical signals can carry more data simultaneously without resistive losses.
Solution Approach 2:
The patent introduces photonic integrated circuits as intermediary components that convert electrical signals to optical signals for transmission between dies. These PICs act as mediators that enable high-speed data transfer without direct electrical connections, thus reducing power consumption and pin count requirements while maintaining or improving data transfer efficiency.
2Device complexity
If memory is centralized in semiconductor packages, then integration is improved, but latency increases due to increased distance for data transfer
Solution Approach 1:
The patent transitions from two-dimensional electrical signal propagation through metal interconnects to three-dimensional optical signal propagation through photonic waveguides and free-space optics. This dimensional change enables light to travel directly between dies stacked in three-dimensional configurations, reducing the effective transmission distance and latency despite increased physical separation caused by centralized memory architecture.
Solution Approach 2:
The patent replaces electrical signal transmission through metal traces with optical signal transmission through photonic integrated circuits. This substitution enables faster signal propagation speeds and allows for direct optical coupling between stacked dies, reducing latency even when memory is centralized in a multi-die package configuration.
3Speed
If electrical pipeline stages are reduced, then data transfer speed improves, but electrical connections must be minimized
Solution Approach 1:
The patent replaces multiple electrical pipeline stages with direct optical transmission between photonic integrated circuits. By converting data to optical signals, the system eliminates the need for sequential electrical processing stages, achieving higher data transfer speeds with fewer connection points and reduced electrical interconnect complexity.
Solution Approach 2:
The patent extracts the data transmission function from electrical domain to optical domain, removing the need for electrical pipeline stages and intermediate electrical connections. This extraction allows data to be transmitted directly as light signals between dies, reducing both the number of electrical connections required and the number of processing stages needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
OMIBs provide faster, lower power consumption, and improved latency by directly transporting data photonically to the compute point, enhancing the feasibility of complex AI systems.
Implementation Method 1
The modulator is configured to receive a temperature-dependent bias voltage. The temperature dependence of the temperature-dependent bias voltage inversely matches the temperature dependence of the modulator over an extended temperature range.
Data Source
AI summary
A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.