Optically bridged multicomponent package with extended temperature range
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Solution Overview
Problem
Existing electrical interconnects in semiconductor dies for AI and machine learning applications face high power consumption, pin count limitations, and inefficiency in data transfer, especially when memory is centralized, leading to increased latency and bandwidth constraints.
Innovation Solution
Implementing optical multi-die interconnect bridges (OMIBs) with temperature-stabilized modulators to facilitate photonic data transfer directly to the central compute region, reducing reliance on electrical connections and enhancing bandwidth and latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If electrical interconnects are used for data transfer between semiconductor dies, then data transfer can be achieved, but power consumption is high and pin count is limited
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using photonic integrated circuits. Light signals carry data between semiconductor dies, eliminating the need for electrical connections and reducing power consumption while increasing data transfer bandwidth and efficiency.
Solution Approach 2:
The patent introduces an optical intermediary layer (photonic integrated circuit with modulator and photodetector) that converts electrical signals to optical signals for data transmission. This intermediary enables high-speed data transfer with lower power consumption compared to direct electrical interconnects.
2Productivity
If memory is centralized in semiconductor packages, then bandwidth can be increased, but latency increases due to distance from compute regions
Solution Approach 1:
The patent transitions from two-dimensional electrical signal propagation to three-dimensional optical signal propagation using vertical photonic interconnects. This allows memory to be positioned centrally for high bandwidth while optical signals rapidly transmit data to distributed compute regions with minimal latency.
Solution Approach 2:
The patent replaces electrical signal transmission with optical signal transmission to reduce latency. Light signals travel faster and with less attenuation than electrical signals, enabling low-latency communication between centralized memory and distributed compute regions.
3Productivity
If electrical connections are used to connect driver circuit to modulator, then data transfer is possible, but the number of pins and complexity increases
Solution Approach 1:
The patent extracts the data transfer function from electrical pin connections and implements it through optical transmission. The photonic integrated circuit integrates the modulator, photodetector, and waveguides on-chip, eliminating the need for numerous external electrical connections and reducing package complexity.
Solution Approach 2:
The patent merges multiple functions (modulation, detection, signal transmission) into a single photonic integrated circuit module. This integration reduces the number of discrete components and connections required, simplifying the overall system while maintaining high data transfer capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
OMIBs provide faster, more power-efficient data transfer by carrying data photonically to the point of compute, reducing electrical pipeline stages and electrical connections, thereby improving latency and bandwidth for AI workloads.
Implementation Method 1
a modulator with a first modulator input; the driver circuit is electrically coupled with the first modulator input
Implementation Method 2
a photodetector with a first photodetector output; the second driver input is electrically coupled with the first photodetector output
Data Source
AI summary
A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.