Optical Communications Card Mid-Plane Mounting Density
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Solution Overview
Problem
Existing optical communications systems face limitations in increasing bandwidth due to space constraints and heat generation issues when using edge-mounted or mid-plane mounted parallel optical transceiver modules, which restricts the mounting density and overall data transmission capacity.
Innovation Solution
The optical communications system employs a motherboard circuit board with edge card connectors that allow for high-density mounting of parallel optical communications cards, enabling multiple modules to be mounted closely together on both sides of the card, with electrical connections through air gaps and slots, facilitating both edge-mounting and mid-plane configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple parallel optical transceiver modules are arranged in an array to increase bandwidth, then the system bandwidth increases, but the space required on the front panel increases
Solution Approach 1:
The patent transitions from traditional edge-mounted or front-panel mounted configurations to a mid-plane mounting architecture. Optical transceiver modules are mounted on a mid-plane circuit board that is positioned vertically within the rack, utilizing the vertical dimension and internal rack space rather than consuming front panel area. This dimensional reconfiguration allows multiple modules to be densely packed without increasing the device's front footprint.
Solution Approach 2:
The patent implements a nested hierarchical structure where optical transceiver modules are mounted on a mid-plane board, which itself is mounted within the rack enclosure. The mid-plane board acts as an intermediate carrier that nests multiple modules in a compact arrangement, allowing them to be contained within the existing rack volume without requiring additional front panel real estate.
2Productivity
If the density of optical transceiver modules is increased, then bandwidth capacity increases, but heat generation increases
Solution Approach 1:
The patent introduces a mid-plane circuit board as an intermediary mounting platform between the rack enclosure and the optical transceiver modules. This mid-plane structure provides a dedicated thermal management architecture with improved airflow channels and heat dissipation pathways, allowing heat from densely packed modules to be efficiently removed without compromising module density or bandwidth capacity.
3Productivity
If the spacing between optical transceiver modules is reduced, then mounting density increases, but signal interference may increase
Solution Approach 1:
The patent employs a mid-plane mounting architecture where each optical transceiver module is independently mounted on the circuit board with optimized local routing and shielding. This configuration provides controlled impedance traces and localized signal integrity features for each module, allowing reduced spacing between modules while maintaining signal quality and minimizing interference through targeted electromagnetic shielding and differential signaling practices at each module location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases the mounting density of optical transceiver modules, enhancing the system's bandwidth capacity while minimizing space and heat consumption, thus addressing the limitations of existing mounting methods.
Implementation Method 1
The laser driver circuit outputs electrical signals to the laser diodes to modulate them. When the laser diodes are modulated, they output optical signals that have power levels corresponding to logic 1s and logic 10s.
Implementation Method 2
The RX portion includes a plurality of receive photodiodes that receive incoming optical signals output from the ends of respective receive optical fibers held in the connector. The receive photodiodes convert the incoming optical signals into electrical analog signals.
Implementation Method 3
An optics system of the transceiver module focuses the optical signals produced by the laser diodes into the ends of respective transmit optical fibers held within a connector that mates with the transceiver module.
Data Source
AI summary
An optical communications card is provided that has multiple parallel optical communications modules mounted on one or both sides of the card. A plurality of the optical communications cards can be edge-mounted and/or mid-plane mounted in an optical communications system such that the cards are electrically connected to a motherboard PCB. Because the spacing, or pitch, between the edge-mounted or mid-plane mounted cards can be very small, the cards can be mounted with very high density to provide the optical communications system with very high bandwidth.