Optical Semiconductor Chassis Temperature Sensing Without Extra Terminals
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Solution Overview
Problem
The challenge is to detect temperature in optical semiconductor devices with a reduced number of terminals, as existing devices face difficulties in temperature detection when the number of terminals is insufficient, particularly when terminals for thermistors are not secured, and increasing the number of terminals is hindered by downsizing constraints.
Innovation Solution
The solution involves an optical semiconductor device with a chassis, a feedthrough, a connection terminal, a first temperature detector on the external wall, and a flexible substrate, where the temperature detector is not connected to external terminals, allowing for accurate temperature detection without increasing the number of terminals. The temperature detector is bonded to the external wall via heat dissipation resin, and a wavelength tunable laser element with a second temperature detector is optionally included to adjust temperature, using a flexible substrate to connect to the connection terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of terminals is increased to detect temperature, then temperature detection capability is improved, but device size increases and downsizing is hindered
Solution Approach 1:
The patent combines the temperature detector with the chassis structure by providing it on an external face of the chassis external wall. The detector is electrically connected to the flexible substrate through the chassis wall, merging the temperature sensing function into the existing chassis structure rather than adding separate terminal components.
Solution Approach 2:
The chassis external wall serves as an intermediary structure that allows the temperature detector to be mounted externally while maintaining electrical connection to internal components through the flexible substrate. This mediator approach enables temperature detection without requiring additional external terminals.
2Measurement precision
If terminals for thermistor are secured, then temperature detection is enabled, but the number of terminals increases which is difficult when device is downsized
Solution Approach 1:
The flexible substrate serves multiple functions: it provides electrical connections for laser diode driving signals, modulation signals, and temperature detector signals. By making the flexible substrate multi-functional, the patent eliminates the need for separate terminals for each function, reducing overall terminal count while maintaining all necessary connections.
Solution Approach 2:
The patent merges the temperature detection function with the existing flexible substrate connection system. The temperature detector is electrically connected to the flexible substrate alongside other signal lines, combining multiple functions into a single connection infrastructure rather than requiring separate terminal assignments.
3Volume of moving object
If the number of terminals is reduced for downsizing, then device size is reduced, but temperature detection becomes difficult
Solution Approach 1:
The patent moves the temperature detector from an internal position requiring external terminals to an external position on the chassis external wall. This dimensional relocation allows the detector to access temperature information through the chassis wall itself, eliminating the need for additional terminal connections while maintaining detection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective temperature detection while minimizing the number of external connection terminals, allowing for accurate temperature measurement and adjustment, and downsizing the device by utilizing the space around the projection portion effectively.
Implementation Method 1
a first temperature detector that is provided on an external face of the external wall of the chassis and detects a temperature of the chassis
Implementation Method 2
The first temperature detector is provided between the external wall and the flexible substrate
Data Source
AI summary
An optical semiconductor device includes a chassis that has an external wall, a feedthrough that penetrates the external wall of the chassis and has a projection portion projecting toward outside of the chassis from the external wall, a connection terminal that is electrically connected to a component mounted in the chassis and is on the projection portion of the feedthrough, a first temperature detector that is on an external face of the external wall of the chassis and detects a temperature of the chassis, and a flexible substrate of which an end is connected to the connection terminal and of which a portion spaced from the end is connected to the first temperature detector, wherein the first temperature detector is between the external wall and the flexible substrate.