Optical Chip Coupling Housing for Reflow-Safe Fiber Alignment
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Solution Overview
Problem
The interconnection of a photoelectric conversion apparatus and a switch substrate via a socket increases the distance and power consumption due to the inability of the fiber array unit to withstand high temperatures in the reflow soldering process, affecting coupling efficiency between optical fibers and waveguides.
Innovation Solution
An optical chip design with a protective housing and coupling space between the photonic integrated circuit and the optical fiber connector, ensuring alignment and protection of coupling ends even in high-temperature environments, using a groove and protective housing to maintain alignment and reduce interference from the injection molding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the photoelectric conversion apparatus is connected to the fiber array unit (FAU) and soldered to the switch substrate in a reflow soldering oven at high temperature, then the interconnection between the photoelectric conversion apparatus and the switch substrate is achieved, but the FAU cannot withstand the high temperature and becomes faulty
Solution Approach 1:
The patent divides the system into two independent parts: the photoelectric conversion apparatus (with its sensitive FAU) and the switch substrate, which are soldered separately to the carrier substrate. This segmentation allows the FAU to avoid exposure to high-temperature reflow soldering, preventing damage while maintaining reliable interconnections.
Solution Approach 2:
The patent introduces a carrier substrate as an intermediary platform that hosts both the photoelectric conversion apparatus and the switch substrate. This mediator enables both components to be interconnected without requiring the FAU to withstand high-temperature soldering processes, as the soldering is performed separately on the carrier substrate.
2Reliability
If the photoelectric conversion apparatus and the switch substrate are interconnected via a socket through mechanical crimping to avoid high temperature, then the FAU is protected from high temperature damage, but the distance between the photoelectric conversion apparatus and the switch substrate increases, leading to increased power consumption
Solution Approach 1:
The patent merges the advantages of both approaches by integrating the photoelectric conversion apparatus and switch substrate onto a single carrier substrate with minimal spacing. This combination achieves both FAU protection (by avoiding high-temperature soldering of the FAU itself) and low power consumption (by minimizing transmission distance through close proximity on the same substrate).
Solution Approach 2:
The patent transitions from traditional vertical stacking or socket-based connections to a planar integration approach on the carrier substrate. This dimensional reorganization allows components to be positioned close together in the same plane, reducing signal transmission distance and power consumption while maintaining FAU protection.
3Manufacturing precision
If the optical fiber and optical waveguide are coupled without a protective housing and coupling space, then the device complexity is reduced, but the coupling efficiency is affected by position shifts and misalignments in high-temperature environments
Solution Approach 1:
The patent implements a protective housing and coupling space that are designed in advance to accommodate and protect the optical fiber-waveguide interface. This pre-designed protective structure compensates for potential position shifts and misalignments that may occur in high-temperature environments, ensuring stable coupling efficiency without requiring complex active adjustment mechanisms.
Data Source
AI summary
An optical chip includes an optical fiber connector, a photonic integrated circuit PIC, a protective housing, and an injection molding layer. The protective housing is located between the injection molding layer and the PIC, and coupling space is formed between the protective housing and the PIC. The optical fiber connector includes an optical fiber. The optical fiber connector has a first connection end that faces the PIC and a second connection end that is away from the PIC. A first coupling end of the optical fiber passes through the first connection end. The first coupling end and a second coupling end of an optical waveguide of the PIC both extend into the coupling space, and the first coupling end located in the coupling space is coupled to the second coupling end. The second connection end is configured to detachably connect to another optical fiber connector.