Optical Chip Cover Mask for Light Field Control and Alignment
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Solution Overview
Problem
Existing electronic devices with optical components face challenges in precisely controlling light radiation and ensuring accurate alignment of optical components, which affects the efficiency and precision of the device assembly.
Innovation Solution
The electronic device incorporates an additional mask with a local opening positioned in front of the optical component, along with an optical element that allows light to pass, to control light radiation and facilitate precise alignment of optical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If an optical element is mounted on the encapsulation cover to allow light to pass, then light transmission is improved, but control over light radiation field becomes difficult
Solution Approach 1:
An additional mask is introduced as an intermediary element between the optical component and the optical element. This mask has a local opening that selectively controls which light rays pass through, acting as a mediator that allows desired light transmission while blocking unwanted light paths. The mask is mounted on the encapsulation cover in front of the optical element, creating a controlled aperture system.
Solution Approach 2:
The additional mask features a local opening with specific geometry and position tailored to the particular optical component's characteristics. Rather than a uniform structure, the mask has localized transparency only where needed, creating different optical paths for different regions. This local quality approach allows precise control over the light field while maintaining overall light transmission.
2Reliability
If optical components are aligned precisely for optimal performance, then device performance is improved, but assembly precision requirements increase
Solution Approach 1:
The additional mask with its local opening is designed to work with the specific optical component's beam characteristics. The mask's opening geometry is tailored to match the light emission or reception pattern of the optical component, allowing the system to self-optimize its light field control without requiring extremely precise manual alignment during assembly. The mask essentially adapts to the optical component's inherent properties.
Solution Approach 2:
The additional mask is mounted on the encapsulation cover before final assembly with the optical component. This preliminary positioning allows the mask to pre-establish the light field control parameters, and then the optical component is aligned to this pre-configured mask rather than requiring the mask to be precisely aligned to the optical component. This reverses the alignment sequence to reduce assembly precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for more controlled light radiation, improves assembly precision, and ensures correct alignment of optical components, enhancing the overall performance and reliability of the electronic device.
Implementation Method 1
an optical element, designed to allow light to pass, which is mounted on the cover and which covers the opening of the cover
Implementation Method 2
an additional mask which is mounted on the cover, which extends in front of the optical element and which has a local opening situated in front of the optical component of the chip. Thus, by virtue of the additional mask having a local opening, the field of the light radiation is more readily controlled
Implementation Method 3
an electronic chip mounted on the front mounting face of the substrate wafer and having, in its front face, an optical component
Data Source
AI summary
An electronic device includes a carrier substrate having a front face and an electronic chip mounted on the front face. An encapsulation cover is mounted above the front face and bounds a chamber in which the chip is situated. A front opening is provided in front of an optical component of the chip. An optical element, designed to allow light to pass, is mounted on the cover in a position which covers the front opening of the cover. The optical element includes a central region designed to deviate light and a positioning pattern that is visible through the front opening. An additional mask is mounted on the encapsulation cover in a position which extends in front of the optical element. A local opening of the additional mask is situated in front of the optical component.