Hermetic Optical Chip Packaging With Conductive Carrier Board Cooling
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Solution Overview
Problem
Existing LiDAR systems face challenges in effectively dissipating heat generated by their components, which can lead to performance issues and reduced yield.
Innovation Solution
An optical chip packaging module with a carrier board and a light-transmitting cover plate forms a hermetic space, using thermally conductive materials like ceramic and metal to rapidly dissipate heat from the optical chip, combined with a barrier structure for protection and encapsulation to minimize thermal mismatch and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging without specialized thermally conductive materials is used, then device complexity is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent employs composite thermally conductive materials comprising ceramic particles (such as aluminum oxide or aluminum nitride) embedded in a metal matrix (such as aluminum or copper). This composite structure combines the high thermal conductivity of metals with the high melting point and chemical stability of ceramics, achieving superior heat dissipation capability while managing thermal expansion mismatch between components
Solution Approach 2:
The patent modifies the thermal conductivity parameter of the packaging substrate by incorporating thermally conductive ceramic materials and metallized layers. The substrate's thermal conductivity is enhanced from conventional levels to specifically engineered values (e.g., ≥100 W/m·K) to match the thermal characteristics of mounted components, thereby improving overall heat dissipation performance
2Temperature
If thermally conductive ceramic materials are embedded in the substrate, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates thermally conductive ceramic materials and metallized layers into the substrate during the substrate manufacturing process itself, before component mounting. This preliminary integration of thermal management features into the substrate fabrication stage eliminates the need for separate post-assembly thermal modification steps, thereby improving heat dissipation while managing manufacturing complexity
Solution Approach 2:
The patent designs the substrate to simultaneously serve multiple functions: mechanical support for components, electrical connection pathway, and thermal conduction medium. By integrating these functions into a single multi-functional substrate structure with embedded ceramic materials and metallized layers, the patent achieves improved heat dissipation without proportionally increasing overall manufacturing complexity
3Temperature
If rapid heat dissipation is implemented using high thermal conductivity materials, then temperature control is improved, but thermal stress and delamination risk increase
Solution Approach 1:
The patent applies different material properties to different regions of the packaging structure. The substrate incorporates thermally conductive ceramic materials in specific regions where heat generation is highest, while maintaining appropriate thermal expansion characteristics in other areas. This localized optimization of material properties enables effective heat dissipation from critical components while managing thermal stress distribution across the entire structure to prevent delamination
Solution Approach 2:
The patent carefully selects and combines materials with compatible thermal expansion coefficients to minimize thermal stress during temperature cycling. The substrate's composite structure (ceramic particles in metal matrix) is designed to have thermal expansion properties that match both the mounted components and the encapsulant material, thereby preventing delamination caused by differential thermal expansion while maintaining effective heat dissipation
4Reliability
If hermetic sealing is implemented to protect components, then reliability is improved, but heat dissipation efficiency may deteriorate
Solution Approach 1:
The patent introduces thermally conductive adhesive materials as intermediaries between components and the substrate, and between the substrate and the encapsulant. These adhesive intermediaries serve dual functions: providing hermetic sealing to protect components from environmental factors, and maintaining efficient thermal conduction pathways. The thermally conductive adhesive fills the interface gap, eliminating thermal contact resistance while providing environmental protection, thereby resolving the contradiction between sealing and heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid heat dissipation and ensures high yield by effectively managing thermal stress, enhancing the reliability and performance of LiDAR components.
Implementation Method 1
the carrier board includes a thermally conductive material in contact with the optical chip
Data Source
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AI summary
An optical chip packaging module, an optical module, and a LiDAR are provided. The optical chip packaging module includes a carrier board and a light-transmitting cover plate covering the carrier board, forming a hermetic space between the carrier board and the light-transmitting cover plate. Within the hermetic space, an optical chip is fixed on the carrier board. The carrier board includes a thermally conductive material in contact with the optical chip, wherein the thermally conductive material includes ceramic material and/or metal material.