Optical-Electrical Chip Package With Horizontal Signal Path
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Solution Overview
Problem
Conventional approaches for forming packages with optical and electric chips suffer from high complexity and signal distortion, particularly in compact designs with closely spaced contacts.
Innovation Solution
A package design where optical and electric chips are embedded side-by-side in a component carrier with a horizontal signal path, utilizing a component carrier with conductive and insulating layers to facilitate horizontal signal propagation and reduce signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional approaches are used to form packages with optical and electric chips, then the chips can be connected, but the manufacturing complexity increases and signal distortion occurs
Solution Approach 1:
The patent transitions from vertical stacking of optical and electric chips to a horizontal side-by-side arrangement within the component carrier. This dimensional change enables direct horizontal signal paths between the chips, eliminating the need for complex vertical interconnection structures and reducing signal distortion while maintaining functional connectivity.
Solution Approach 2:
The patent integrates both optical and electric chips within a single component carrier structure, allowing them to be embedded side-by-side and interconnected through horizontal signal paths. This merging approach simplifies the overall package architecture by consolidating multiple chip types and their interconnections into one unified structure, reducing manufacturing complexity.
2Volume of moving object
If chips are placed close together to achieve compact design, then space is saved, but signal distortion increases
Solution Approach 1:
By arranging chips side-by-side horizontally rather than stacking them vertically, the patent achieves compact packaging in the horizontal plane while maintaining adequate signal path lengths. The horizontal signal paths travel through the component carrier substrate, providing controlled impedance and reduced signal distortion even at close spacing.
Solution Approach 2:
The component carrier substrate acts as an intermediary medium that facilitates signal transmission between the horizontally arranged optical and electric chips. The substrate's controlled impedance and signal path design enable reliable signal integrity even when chips are placed close together, mediating the interaction between compact spacing and signal quality.
Data Source
AI summary
Provided is a package having a component carrier with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an optical chip and an electric chip being functionally coupled with each other and being embedded side-by-side in the component carrier so that a signal path between the optical chip and the electric chip is within a horizontal plane.