Optical Chip Lens Array Packaging for Tolerance-Tolerant Fiber Coupling
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Solution Overview
Problem
The mechanical tolerance in detachable connections between optical fiber connectors and photoelectric conversion apparatuses in optical communication devices leads to reduced coupling efficiency between optical fiber arrays and optical waveguide arrays due to imprecise optical alignment.
Innovation Solution
An optical chip design incorporating a photonic integrated circuit (PIC), a fastening substrate, and lens arrays that optically align optical fibers, lenses, and optical waveguides through a fastening substrate, ensuring precise alignment and stability even in high-temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a mechanical structure is used for detachable connection between optical fiber connector and photoelectric conversion apparatus, then ease of operation is improved, but manufacturing precision deteriorates due to large tolerance
Solution Approach 1:
A fastening substrate is introduced as an intermediary component between the optical fiber connector and the photonic integrated circuit. The fastening substrate includes a first end configured to detachably connect to the optical fiber connector and a second end connected to the PIC, serving as a mediator that bridges the mechanical connection interface and the optical components.
Solution Approach 2:
Lens arrays are added to the optical path to compensate for misalignment in the mechanical connection dimension. The lens arrays refract and redirect light to achieve optical alignment compensation, transforming the problem from a purely mechanical alignment issue to an optical path adjustment problem.
2Manufacturing precision
If lens arrays are added to compensate for mechanical tolerance, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
Multiple lenses are integrated into lens arrays that are collectively mounted on the fastening substrate. The lens arrays combine multiple optical elements into unified structures, reducing the number of separate components and simplifying the overall assembly process while maintaining optical alignment precision.
Solution Approach 2:
The fastening substrate serves multiple functions: it provides mechanical support for the PIC, enables detachable connection to the optical fiber connector, mounts the lens arrays, and maintains the spatial relationships between all optical components. This multi-functionality reduces the need for separate structural elements.
3Stability of the object's composition
If fastening substrate is used to mount lens arrays, then stability is improved, but device complexity increases
Solution Approach 1:
The fastening substrate is designed as a multi-functional component that simultaneously provides mechanical support, electrical connection interfaces, optical mounting surfaces, and structural rigidity. By consolidating these functions into a single substrate, the overall device complexity is reduced despite the enhanced stability it provides.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances coupling efficiency between optical fiber and waveguide arrays by compensating for mechanical tolerances, maintaining alignment, and preventing misalignment or contamination, thereby improving signal transmission efficiency.
Implementation Method 1
The first lens and the second lens are jointly configured to converge an optical signal from the optical waveguide to the optical fiber, or the first lens and the second lens are jointly configured to converge an optical signal from the optical fiber to the optical waveguide
Data Source
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AI summary
An optical chip (400), a packaging method for the optical chip (400), and a related device are provided, which can improve coupling efficiency between an optical fiber array of an optical fiber connector (403) and an optical waveguide array of the optical chip (400) when a mechanical tolerance exists in a detachable connection between the optical chip (400) and the optical fiber connector (403). The optical chip (400) includes a photonic integrated circuit PIC (401), a fastening substrate (402), a first lens array (450), and a second lens array (460). A first end of the fastening substrate (402) is configured to detachably connect to the optical fiber connector (403), and a second end of the fastening substrate (402) is connected to the photonic integrated circuit PIC (401). The optical chip (400) includes at least one optical channel. Each of the at least one optical channel includes optical waveguides (411, 412, 413, and 414) located on a surface of the photonic integrated circuit PIC (401), second lenses (461, 462, 463, and 464) included in the second lens array (460), and first lenses (451, 452, 453, and 454) included in the first lens array (450). Optical fibers (421, 422, 423, and 424) of the optical fiber connector (403), the first lenses (451, 452, 453, and 454), the second lenses (461, 462, 463, and 464), and the optical waveguides (411, 412, 413, and 414) are optically aligned in sequence.