Optical Chip Packaging Layout for LiDAR Light Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The packaging of LiDAR chips poses challenges due to the need for both protection and light transmission, while also requiring integration of various components on a carrier board, making it difficult to distinguish between emitting and receiving modules during the packaging process.
Innovation Solution
An optical chip packaging module is developed, featuring a substrate with optical and non-optical regions separated by a barrier member, allowing for effective separation and protection of optical and non-optical components. This module includes a light-transmitting area for emitting outgoing light beams, and uses a plastic packaging material to reinforce the structure and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If various chips and devices are integrated on the same carrier board for unified packaging, then packaging protection and light transmission requirements are met, but it becomes difficult to distinguish between emitting and receiving modules during the packaging process
Solution Approach 1:
The substrate is divided into distinct optical regions and non-optical regions, with the optical region further segmented into emitting and receiving areas. This spatial segmentation allows different module types to be packaged on the same carrier board while maintaining clear identification and differentiation during the packaging process through region-specific barrier member configurations.
2Strength
If optical chips are packaged with protection structures, then chip strength is improved, but packaging cost increases
Solution Approach 1:
The barrier member serves multiple functions simultaneously: it provides mechanical protection for the optical chip, acts as a light-transmitting window, defines optical regions, and enables module identification. This multi-functionality eliminates the need for separate protective structures, reducing packaging cost while maintaining chip strength.
Solution Approach 2:
The barrier member is made from a uniform light-transmitting material that provides consistent protective properties across all optical chips on the carrier board. This homogeneous approach simplifies the packaging process and reduces costs compared to using different protective structures for different chip types.
3Manufacturing precision
If optical chips are specially differentiated and protected during packaging, then packaging precision is improved, but packaging process complexity increases
Solution Approach 1:
The substrate is pre-divided into optical and non-optical regions with specific area ratios before chip placement. The barrier members are pre-positioned to define emitting and receiving areas, establishing clear packaging guidelines in advance. This preliminary structuring enables standard化的 packaging processes without requiring complex real-time differentiation during assembly.
Data Source
AI summary
An optical chip packaging module, an optical module, and a LiDAR are provided. The optical chip packaging module includes: a substrate provided with an optical region and a non-optical region; an optical chip fixed in the optical region of the substrate; a barrier member fixed on the substrate for isolating the optical region from the non-optical region, so as to separate the optical chip in the optical region from a device in the non-optical region; and a light-transmitting area located above the optical region, from which an outgoing light beam of the optical chip is emitted.